INTEGRATED CIRCUITS DATA SHEET TDA8542 2 × 1 W BTL audio amplifier Product specification Supersedes data of 1997 Feb 19 File under Integrated Circuits, IC01 1998 Apr 01
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 FEATURES APPLICATIONS • Flexibility in use • Portable consumer products • Few external components • Personal computers • Low saturation voltage of output stage • Motor-driver (servo).
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 BLOCK DIAGRAM VCCL VCCR handbook, full pagewidth 9 16 − INL− INL+ 14 13 15 − + OUTL− R VCCL R − − 20 kΩ 2 OUTL+ + 20 kΩ STANDBY/MUTE LOGIC TDA8542 − INR− INR+ 11 12 10 − + OUTR− R VCCR R − − 20 kΩ SVR 7 OUTR+ + 4 20 kΩ MODE BTL/SE 3 5 STANDBY/MUTE LOGIC 1 8 MGB975 LGND Fig.1 Block diagram.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 PINNING FUNCTIONAL DESCRIPTION SYMBOL PIN The TDA8542(T) is a 2 × 1 W BTL audio power amplifier capable of delivering 2 × 1 W output power to an 8 Ω load at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +18 V VI input voltage −0.3 VCC + 0.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 DC CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. VCC supply voltage operating 2.2 5 MAX. 18 UNIT V Iq quiescent current RL = ∞; note 1 − 15 22 mA Istb standby current VMODE = VCC − − 10 µA VO DC output voltage note 2 − 2.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 AC CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS Po output power THD = 10% THD = 0.5% THD total harmonic distortion Po = 0.5 W Gv closed loop voltage gain note 1 MIN. TYP. MAX. UNIT 1.2 − W 0.6 0.9 − W − 0.15 0.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 TEST AND APPLICATION INFORMATION SE application Test conditions Tamb = 25°C if not specially mentioned, VCC = 7.5 V, f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The SE application diagram is illustrated in Fig.14.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 BTL APPLICATION handbook, full pagewidth VCC 1 µF R2 R1 50 kΩ INL− 10 kΩ ViL INL+ 16 100 µF 100 nF 9 14 15 OUTL− 13 C3 47 µF RL 2 OUTL+ OUTR− 1 µF 50 kΩ R4 R3 INR− INR+ 10 kΩ ViR SVR MODE BTL/SE TDA8542 11 10 12 OUTR− RL 4 7 3 5 1 OUTR+ 8 R2 Gain left = 2 × -------R1 GND R4 Gain right = 2 × -------R3 MBH798 Fig.3 BTL application.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 MGD892 10 MGD893 −60 handbook, halfpage handbook, halfpage αcs (dB) THD (%) (1) −70 1 (2) (1) −80 (3) (2) 10−1 −90 10−2 10 102 103 104 f (Hz) −100 10 105 102 103 104 f (Hz) 105 VCC = 5 V, Vo = 2 V, RL = 8 Ω. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB. Po = 0.5 W, Gv = 20 dB. (1) VCC = 5 V, RL = 8 Ω. (2) VCC = 9 V, RL = 16 Ω. Fig.7 Channel separation as a function of frequency. Fig.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 MGD896 3 MGD897 3 handbook, halfpage handbook, halfpage (1) P (W) P (W) 2 2 (1) (2) (2) 1 1 0 0 4 0 8 VCC (V) 0 12 0.5 1 1.5 2.5 2 Po (W) (1) RL = 8 Ω. (2) RL = 16 Ω. Sine wave of 1 kHz. (1) VCC = 9 V, RL = 16 Ω. (2) VCC = 5 V, RL = 8 Ω. Fig.10 Worst case power dissipation as a function of VCC. Fig.11 Pdis as a function of Po.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 SE APPLICATION handbook, full pagewidth VCC 1 µF R2 R1 100 kΩ 10 kΩ ViL 16 INL− 9 14 INL+ 15 13 470 µF OUTR− 1 µF 2 100 kΩ OUTL+ 11 INR+ ViR RL TDA8542 INR− 10 kΩ C4 OUTL− C3 47 µF R4 R3 100 µF 100 nF 12 10 SVR 4 MODE 7 3 BTL/SE 5 1 C5 OUTR− OUTR+ 470 µF RL 8 R2 Gain left = -------R1 GND R4 Gain right = -------R3 MBH799 Fig.14 Single-ended application.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 MGD901 −20 handbook, halfpage αcs MGD902 −20 handbook, halfpage (dB) SVRR (dB) −40 (1) −40 −60 (2) (1) (3) −80 (2) (4) (5) −60 (3) −100 10 102 103 104 f (Hz) 105 −80 10 Vo = 1 V, Gv = 20 dB. (1) VCC = 5 V, RL = 32 Ω, to buffer. (2) VCC = 7.5 V, RL = 4 Ω. (3) VCC = 9 V, RL = 8 Ω. (4) VCC = 12 V, RL = 16 Ω. (5) VCC = 5 V, RL = 32 Ω. 102 103 104 f (Hz) 105 VCC = 7.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 MGD905 2.4 handbook, halfpage P (W) (1) 1.6 (2) (3) 0.8 0 0 0.4 0.8 1.2 Po (W) 1.6 Sine wave of 1 kHz. (1) VCC = 12 V, RL = 16 Ω. (2) VCC = 7.5 V, RL = 4 Ω. (3) VCC = 9 V, RL = 8 Ω. Fig.21 Power dissipation as a function of Po.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 handbook, full pagewidth a. Top view. +VCC GND 100 µF +OUT1 −OUT1 12 kΩ 100 nF 12 kΩ 1 MODE 56 kΩ IN1 16 1 µF P3 11 kΩ TDA8542 11 kΩ 47 µF 1 µF B/S 8 9 56 kΩ +OUT2 IN2 −OUT2 MBH921 b. Component side. Fig.22 Printed-circuit board layout (BTL and SE).
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board.
Philips Semiconductors Product specification 2 × 1 W BTL audio amplifier TDA8542 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd.