INTEGRATED CIRCUITS DATA SHEET TDA6106Q Video output amplifier Product specification File under Integrated Circuits, IC02 1997 Mar 03
Philips Semiconductors Product specification Video output amplifier TDA6106Q FEATURES GENERAL DESCRIPTION • No external heatsink required The TDA6106Q is a monolithic video output amplifier with a 6 MHz bandwidth and is contained in a 9-lead plastic DIL-bent-SIL medium power package. The device uses high-voltage DMOS technology and is intended to drive the cathode of a CRT. To obtain maximum performance, the amplifier should be used with black current control.
Philips Semiconductors Product specification Video output amplifier TDA6106Q PINNING SYMBOL PIN DESCRIPTION n.c. 1 not connected n.c. 2 not connected Vin 3 inverting input voltage GND 4 ground, substrate Iom 5 black current measurement output VDD 6 n.c. handbook, halfpage n.c. 1 n.c. 2 Vin 3 GND 4 supply voltage Iom 5 7 not connected VDD 6 Voc 8 cathode output voltage n.c. 7 Vof 9 feedback output voltage Voc 8 Vof 9 TDA6106Q MBG342 Fig.
Philips Semiconductors Product specification Video output amplifier TDA6106Q HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ).
Philips Semiconductors Product specification Video output amplifier SYMBOL PARAMETER TDA6106Q CONDITIONS MIN. TYP. MAX. UNIT tpd cathode output propagation delay time 50% input to 50% output Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 38 49 60 ns tr cathode output rise time 10% output to 90% output Voc = 50 to 150 V square wave; f < 1 MHz; tfin = 40 ns; see Fig.
Philips Semiconductors Product specification Video output amplifier TDA6106Q x Vi 0 t x ts overshoot (in %) Voc 151 150 140 149 100 60 50 t tr MGA974 t pd Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal.
Philips Semiconductors Product specification Video output amplifier TDA6106Q x Vi 0 t x ts 150 140 Voc 100 overshoot (in %) 51 60 50 49 t tf MGA975 t pd Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal. Flashover protection VDD to GND must be decoupled: The TDA6106Q incorporates a protection diode against CRT flashover discharges that clamp the cathode output voltage to a maximum of VDD + Vdiode. To limit the diode current, an external 1.
Philips Semiconductors Product specification Video output amplifier TDA6106Q TEST AND APPLICATION INFORMATION Cpar handbook, full pagewidth Rfb C1 Vin R10 100 kΩ 22 nF R9 C2 866 Ω 200 V C6 100 nF 22 µF Cn 560 pF 6 R1 50 Ω 3 0.98 mA 9 TDA6106Q 8 4 C8 5 C7 A 3.2 pF Vom 4V 6.8 pF R3 20 MΩ probe C9 136 pF R2 1 MΩ GND MBG344 Cpar = 150 fF. Fig.5 Test circuit with feedback factor 1⁄116.
Philips Semiconductors Product specification Video output amplifier TDA6106Q INTERNAL PIN CONFIGURATION handbook, full pagewidth GND VDD 4 6 from input circuit TDA6106Q esd esd esd Vin 9 Vbias from reference circuit Vof from input circuit 3 esd flash prot. Iom esd from pin 9 5 flash prot. 8 from pin 9 6.8 V esd from reference circuit to BCS-circuit output MBG345 Fig.6 Internal pin configuration.
Philips Semiconductors Product specification Video output amplifier TDA6106Q PACKAGE OUTLINE DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 D D1 A2 q P P1 Q A3 q2 q1 A seating plane A4 E pin 1 index c L 1 9 e2 b e Z b2 0 θ w M b1 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mm 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.
Philips Semiconductors Product specification Video output amplifier TDA6106Q The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages.
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