INTEGRATED CIRCUITS DATA SHEET TDA2549 I.F.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 GENERAL DESCRIPTION The TDA2549 is a complete i.f. circuit with a.f.c., a.g.c., demodulation and video preamplification facilities for multistandard television receivers. It is capable of handling positively and negatively modulated video signals in both colour and black/white receivers. Features • Gain-controlled wide-band amplifier providing complete i.f.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 Fig.1 Block diagram.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pins 13 and 21) VP 13,8 V Storage temperature range Tstg −25 to +125 °C Operating ambient temperature range Tamb −25 to +70 °C CHARACTERISTICS (measured in fig.5) VP = 12 V; Tamb = 25 °C PARAMETER SYMBOL MIN. TYP. MAX.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 PARAMETER SYMBOL MIN. TYP. MAX. UNIT V15-3 10 − − V ∆f − 70 200 kHz V17-3 − − 1,5 V positive a.f.c. (Fig.2) V16-3 0 − 1,5 V negative a.f.c. (Fig.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 Fig.2 A.F.C. output voltage V15-3 for positive a.f.c. Fig.3 A.F.C. output voltage V15-3 for negative a.f.c. Fig.4 Video output waveform showing white spot and noise inverter threshold levels.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 APPLICATION INFORMATION Fig.5 Application diagram.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 PACKAGE OUTLINE seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.
Philips Semiconductors Product specification I.F. amplifier and demodulator for multistandard TV receivers TDA2549 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
