INTEGRATED CIRCUITS DATA SHEET TDA1519C 22 W BTL or 2 × 11 W stereo power amplifier Product specification Supersedes data of 2001 Aug 24 2004 Jan 28
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C FEATURES GENERAL DESCRIPTION • Requires very few external components for Bridge-Tied Load (BTL) operation The TDA1519C is an integrated class-B dual output amplifier in a 9-lead plastic single in-line power package or 20-lead heatsink small outline package.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage operating 6.0 14.4 17.5 V non-operating − − 30 V load dump protected − − 45 V IORM repetitive peak output current − − 4 A Iq(tot) total quiescent current − 40 80 mA Istb standby current − 0.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C BLOCK DIAGRAM handbook, full pagewidth NINV mute switch 1 Cm 60 kΩ VA 4 OUT1 183 Ω power stage 18.1 kΩ VP 8 + standby switch − M/SS standby reference voltage VA 15 kΩ + + − ×1 RR 3 15 kΩ mute reference voltage mute switch TDA1519C TDA1519CSP 18.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C PINNING PIN SYMBOL DESCRIPTION TDA1519C; TDA1519CSP TDA1519CTD TDA1519CTH NINV 1 19 19 GND1 2 20 20 ground 1 (signal) RR 3 1 1 supply voltage ripple rejection OUT1 4 3 3 output 1 GND2 5 5 5 ground 2 (substrate) OUT2 6 8 8 output 2 VP 7 10 10 positive supply voltage M/SS 8 11 11 mute/standby switch input INV 9 12 12 inverting input n.c.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C • Low standby current (<100 µA) FUNCTIONAL DESCRIPTION • Low mute/standby switching current (allows for low-cost supply switch) The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/standby switch which has the following features: • Mute condition.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient; in free air TDA1519C, TDA1519CTH and TDA1519CTD 40 K/W Rth(j-c) thermal resistance from junction to case; TDA1519C, TDA1519CTH and TDA1519CTD 3 K/W DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in circuit of Fig.6; unless otherwise specified.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Stereo application (see Fig.6) Po output power note 1 THD = 0.5 % 4 5 − W THD = 10 % 5.5 6.0 − W 7.5 8.5 − W RL = 2 Ω; note 1 THD = 0.5 % 10 11 − W THD total harmonic distortion Po = 1 W − 0.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier SYMBOL SVRR TDA1519C PARAMETER supply voltage ripple rejection Zi input impedance Vn(o)(rms) noise output voltage (RMS value) CONDITIONS MIN. TYP. MAX.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C APPLICATION INFORMATION handbook, full pagewidth standby switch 100 µF VP 3 input reference voltage 220 nF non-inverting input + 40 dB 2 5 60 kΩ 40 dB + 1 7 2200 µF internal 1/2 VP TDA1519C − 60 kΩ 8 100 nF − 4 220 nF 9 inverting input 6 MGL493 signal ground power ground 1000 µF Fig.6 Stereo application diagram (TDA1519C).
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C MGR539 60 handbook, halfpage Iq(tot) (mA) 50 40 30 0 4 8 12 16 20 VP (V) Fig.8 Total quiescent current as a function of the supply voltage. MGR540 30 handbook, halfpage Po (W) 20 THD = 10% 10 0.5% 0 0 4 8 12 16 20 VP (V) BTL application. RL = 4 Ω. fi = 1 kHz. Fig.9 Output power as a function of the supply voltage.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C MGR541 12 handbook, halfpage THD (%) 8 4 0 10−1 1 10 Po (W) 102 BTL application. RL = 4 Ω. fi = 1 kHz. Fig.10 Total harmonic distortion as a function of the output power. MGU377 0.6 handbook, halfpage THD (%) 0.4 0.2 0 10 102 103 fi (Hz) 104 BTL application. RL = 4 Ω. Po = 1 W. Fig.11 Total harmonic distortion as a function of the operating frequency.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 9 e Z Q w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 max. A2 b max. bp c D (1) d Dh E (1) e Eh j L Q w x Z (1) mm 2 4.6 4.4 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C SMS9P: plastic surface mounted single in-line power package; 9 leads SOT354-1 D y d non-concave heatsink A2 Dh x heatsink Eh j E Q A1 L Lp c 9 1 e Z θ w M bp (A3) A 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 bp c mm 4.9 4.2 0.35 0.05 4.6 4.4 0.25 0.75 0.60 0.48 0.38 D(1) d 24.0 20.0 23.6 19.6 Dh E(1) 10 12.2 2.54 11.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C HSOP20: plastic, heatsink small outline package; 20 leads SOT397-1 E D A E2 X HE v M A c y D1 D2 11 20 Q A2 E1 A (A3) A1 A4 pin 1 index θ Lp detail X 1 10 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A1 max. A2 A3 A4 0.3 0.1 3.3 3.0 0.35 0.1 0 3.6 D1 D2 E(1) E1 E2 e HE Lp Q 0.53 0.32 16.0 13.0 0.40 0.23 15.8 12.6 1.1 0.9 11.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 −0.04 0.40 0.23 15.8 12.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C SOLDERING cooling) vary between 100 and 200 seconds depending on heating method. Introduction Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: This text gives a very brief insight to a complex technology.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10.
Philips Semiconductors Product specification 22 W BTL or 2 × 11 W stereo power amplifier TDA1519C DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date.
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