INTEGRATED CIRCUITS DATA SHEET TDA1015 1 to 4 W audio power amplifier Product specification File under Integrated Circuits, IC01 November 1982
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 The TDA1015 is a monolithic integrated audio amplifier circuit in a 9-lead single in-line (SIL) plastic package. The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 Ω load impedance. The very low applicable supply voltage of 3,6 V permits 6 V applications.
Philips Semiconductors Product specification TDA1015 Fig.1 Circuit diagram.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 RATINGS Limiting values in accordance with Absolute Maximum System (IEC 134) Supply voltage VP max. 18 V Peak output current IOM max. 2,5 A Total power dissipation see derating curve Fig.2 Storage temperature Tstg −55 to + 150 °C Operating ambient temperature Tamb −25 to + 150 °C tsc max. hours A.C. short-circuit duration of load during sine-wave drive; VP = 12 V Fig.2 Power derating curve.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 D.C. CHARACTERISTICS Supply voltage range VP Repetitive peak output current IORM Total quiescent current at VP = 12 V Itot 3,6 to 18 V < 2 A typ. 14 mA < 25 mA A.C. CHARACTERISTICS Tamb = 25 °C; VP = 12 V; RL = 4 Ω; f = 1 kHz unless otherwise specified; see also Fig.3. A.F. output power at dtot = 10% (note 1) with bootstrap: VP = 12 V; RL = 4 Ω Po typ. 4,2 W VP = 9 V; RL = 4 Ω Po typ.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Notes 1. Measured with an ideal coupling capacitor to the speaker load. 2. Measured with a load resistor of 20 kΩ. 3. Measured at Po = 1 W; the frequency response is mainly determined by C1 and C3 for the low frequencies and by C4 for the high frequencies. 4. Independent of load impedance of preamplifier. 5. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave). 6.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 APPLICATION INFORMATION Fig.4 Circuit diagram of a 1 to 4 W amplifier. Fig.5 Total quiescent current as a function of supply voltage.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier Fig.6 TDA1015 Total harmonic distortion as a function of output power across RL; with bootstrap; − − − without bootstrap; f = 1 kHz; typical values. The available output power is 5% higher when measured at pin 2 (due to series resistance of C10). Fig.7 Output power across RL as a function of supply voltage with bootstrap; dtot = 10%; typical values.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.8 Voltage gain as a function of frequency; Po relative to 0 dB = 1 W; VP = 12 V; RL = 4 Ω. Fig.9 Total harmonic distortion as a function of frequency; P = 1 W; VP = 12 V; RL = 4 Ω.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.10 Ripple rejection as a function of R2 (see Fig.4); RS = 0; typical values. Fig.11 Noise output voltage as a function of R2 (see Fig.4); measured according to A-curve; capacitor C5 is adapted for obtaining a constant bandwidth.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.12 Noise output voltage as a function of frequency; curve a: total amplifier; curve b: power amplifier; B = 5 kHz; RS = 0; typical values. Fig.13 Voltage gain as a function of R2 (see Fig.4).
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.
Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
