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CONTENTS SUBJECT TO CHANGE WITHOUT NOTICE 1 AVNERA PROPRIETARY & CONFIDENTIAL | PROVIDED UNDER NDA

General Description

The AV6301 / 6302 chipset is optimized for building

wireless gaming headsets and point to multi-point

audio distribution solutions such as rear speakers

and subwoofers in home theater systems..The

chipset is comprised of two ICs: AV6301 (sender)

and AV6302 (client). These devices share the VMI

RF Protocol and may be mixed and matched with

other VMI chips (AAV6200, V6201, and AV6202).

The AV6301 / 02 chipset achieves the goal of

enabling a single core design to service multiple

game platforms (PC or Console), External Digital

Signal Processing (DSP) is also easily supported

for all gaming platforms.

The chip set provides all functions necessary to

complete a bidirectional wireless audio link with

high quality voice and music performance.

Operation in the worldwide 2.4 GHz spectrum

addresses the need for global application.

System / Chipset Features

9 Stereo audio path: >93 dB SNR, 20 kHz

9 Mono voice path: >70 dB SNR, 6.5 kHz

voice

9 Sophisticated audio routing and mixing

options to meet demands of multiple gaming

headset platforms

9 Over-the-air (OTA) serial interface: >2

kbps, bi-directional, full duplex

9 Works within 3 inches of WIFI Client

without impairment to Audio or WIFI throughput

9 Advanced forward error correction coding,

error detection, and audio-specific error

concealment

9 Diversity antenna support

9 Low and Fixed Latency: <16 ms,

9 Long Range: 15m (non-line-of-site)

9 Auto search/sync/standby/wake-

up/shutdown

9 All Voltage Regulators on-chip

9 Interoperability with VMI (AV6201 / 02)

Chipset

AV6301

The AV6301 is a highly integrated, single-chip,

wireless audio sender IC. It integrates the following: a

complete 2.4 GHz RF transceiver, PHY & MAC,

advanced power management hardware, audio DSP,

USB 2.0 transceiver and a full complement of

programmable digital interfaces to support a wide

range of end-product user-interface requirements,

including SPI and TWI interfaces.

The device incorporates a complete USB 2.0

transceiver and enumerates as a USB Audio device

as well as USB Human Interface Device (HID) without

the need for external drivers, enabling true plug &

play. Additionally, the device makes available 3

independent I2S interfaces, allowing independent

processing of non-USB audio sources. Simultaneous

use of the USB and I2S ports is enhanced by

additional audio processing capability, allowing for

independent control and mixing of the different audio

sources.

AV6301 Features

9 Advanced Signal Routing Capability

9 USB Port Enumerates as Audio and / or

Human interface device (HID)

9 Three available I2S ports

9 Simultaneous operation of USB and I2S

ports

9 Expansive Digital I/O Capability

9 20 General Purpose Input / Output Pins

9 Master and Slave SPI and TWI interfaces

9 Pulse Width Modulated (PWM) I/O support

9 Straightforward implementation of external

EEPROM, DSP, Audio Codec and Host uC for

advanced applications

9 On-Chip One-Time-Programmable (OTP)

Memory

Applications

PC Game Wireless Headset

Game Console Wireless Headset

I2S based Wireless Audio

Wireless Rear Speakers

Preliminary Datasheet AV6301

Wireless Audio Sender IC

Summary of content (18 pages)

PAGE 1
Preliminary Datasheet AV6301 Wireless Audio Sender IC General Description AV6301 The AV6301 / 6302 chipset is optimized for building wireless gaming headsets and point to multi-point audio distribution solutions such as rear speakers and subwoofers in home theater systems..The chipset is comprised of two ICs: AV6301 (sender) and AV6302 (client). These devices share the VMI RF Protocol and may be mixed and matched with other VMI chips (AAV6200, V6201, and AV6202).
PAGE 2
Packaging The AV6301 is packaged in a 7 x 7 mm, 48 pin QFN and is rated for operation over the commercial temperature range (0 to 70 degrees C) CONTENTS SUBJECT TO CHANGE WITHOUT NOTICE 2 AVNERA PROPRIETARY & CONFIDENTIAL | PROVIDED UNDER NDA
PAGE 3
AV6301 Datasheet (Preliminary) revision 0.2 Revision History Revision Change Summary Release Date 0.1 0.2 Preliminary release of datasheet Add AV6xxx Selection Grid, Update Audio Routing, Block Diagram, Application Circuit, Pin Out and Pin Description. RF TX Electrical characteristics update. Update Selector Grid CORRECTION to I2S assignments to GPIO ports (stereo in, stereo out and mono out have all changed).I2S assignments reflected in Applications Diagram. Update of selection grid.
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AV6301 Datasheet (Preliminary) revision 0.2 Table of Contents General Description .............................................................................................................................................................. 1 System / Chipset Features ................................................................................................................................................... 1 AV6301.....................................................................................
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AV6301 Datasheet (Preliminary) CONTENTS SUBJECT TO CHANGE WITHOUT NOTICE revision 0.
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AV6301 Datasheet (Preliminary) revision 0.
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AV6301 Datasheet (Preliminary) revision 0.2 1 REFERENCE DIAGRAMS 1.
PAGE 8
AV6301 Datasheet (Preliminary) 1.2 revision 0.2 Functional Diagram VDC 3.6V LDO USB Spnd XTAL SUP VBG REF DIG Regs 3.3V REG V3P6 MCU RFP RFN ROM RAM OTP GPIO 20 RF/IF Transceiver PHY Audio Proc USB GPIO DSCP,DSCN SPI, I2C GPIO (Buttons, LEDs) I2S DP DM Figure 1-2 AV6301 Functional Diagram 1.
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AV6301 Datasheet (Preliminary) 1.4 revision 0.
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AV6301 Datasheet (Preliminary) revision 0.2 2 PIN INFORMATION 2.
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AV6301 Datasheet (Preliminary) 2.2 revision 0.2 Pin Description Table 2-2-1 AV301 pin description Pin No.
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AV6301 Datasheet (Preliminary) Pin No. 38 39 40 41 42 43 44 45 46 47 48 Symbol PWM2 VDDDIG VDD18 VDDIO DM DP GPIO18 PWM1 GPIO5 S_MISO (SPI Slave) S_SCL (TWI Slave) GPIO4 S_MOSI (SPI Slave) S_SDA (TWI Slave) GPIO3 S_SCLK (SPI Slave) UART_RX PWM1 GPIO2 S_SSB (SPI Slave) UART_TX PWM0 GPIO17 PWM2 CONTENTS SUBJECT TO CHANGE WITHOUT NOTICE revision 0.2 Pin Type Description PWM resource #2 Bypass capacitor pin for 1.35V digital core regulator Bypass capacitor pin for 1.
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AV6301 Datasheet (Preliminary) 3 revision 0.2 ELECTRICAL SPECIFICATIONS 3.1 Absolute Maximum Ratings The Absolute Maximum Rating (AMR) corresponds to the maximum value that can be applied without leading to instantaneous or very short-term unrecoverable hard failure (destructive breakdown). Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits.
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AV6301 Datasheet (Preliminary) revision 0.2 3.2 DC Electrical Characteristics Operating Conditions: VDC = 4.4V to 5.5V, VDDIO = 3.3V, TA = 0ºC to +70 ºC; Typical specifications at TA = 25ºC, VDC = 5.0V. Table 3-2 AV6301 DC Electrical Characteristics PARAMETER CONDITIONS MIN VDC Supply Voltage Input 4.4 TYP MAX 5.0 5.5 UNIT V V3P6 Internally regulated voltage 3.6 V VDDIO (Digital 3.3V I/O) Reg. Voltage Internally regulated voltage 3.3 V VDDDIG (Digital Core) Reg.
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AV6301 Datasheet (Preliminary) revision 0.2 3.4 Electrical Characteristics – RF Receiver Operating Conditions: VDC = 4.4V to 5.5V, VDDIO = 3.3V, TA = 0ºC to +70 ºC; RF Channel Freq = 2403.35-2477.35MHz, measured at the single-ended input of the RF balun (with external impedance matching). Typical specifications at TA = 25ºC, VDC = 5.0V.
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AV6301 Datasheet (Preliminary) revision 0.2 4 PACKAGE INFORMATION 4.
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AV6301 Datasheet (Preliminary) 4.2 revision 0.2 Package Marking A V D D D D C C Y Y W W X X L L L L L L T T A Figure 4-2 Package Marking Layout Abbreviations: AVDDDD Product number (i.e. AV6301) CC Country Code (i.e.
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AV6301 Datasheet (Preliminary) revision 0.2 5 CONTACT INFO & LEGAL DISCLAIMER Avnera Corporation 16505 Bethany Court, Suite 100 Beaverton, Oregon 97006 U.S.A. Main: +1.503.718.4100 Fax: +1.503.718.4101 www.avnera.com Avnera Corporation reserves the right to make changes without notice to the product to improve function, reliability, or performance. Avnera Corporation does not assume any liability arising from the application or use of the products or circuits described herein.