BASIC stamp manual v2.2
1: Introduction to the BASIC Stamp
BASIC Stamp Syntax and Reference Manual 2.2 • www.parallax.com • Page 25
Guidelines and Precautions
When using the BASIC Stamp, or any IC chip, please follow the
guidelines below.
1. Be alert to static sensitive devices and static-prone situations.
a. The BASIC Stamp, like other IC’s, can be damaged by
static discharge that commonly occurs touching
grounded surfaces or other conductors. Environmental
conditions (humidity changes, wind, static prone
surfaces, etc) play a major role in the presence of random
static charges. It is always recommended to use
grounding straps and anti-static or static dissipative mats
when handling devices like the BASIC Stamp. If the
items above are not available, be sure to touch a
grounded surface after you have approached the work
area and before you handle static sensitive devices.
2. Verify that all power is off before connecting/disconnecting.
a. If power is connected to the BASIC Stamp or any device it
is connected to while inserting or removing it from a
circuit, damage to the BASIC Stamp or circuit could
result.
3. Verify BASIC Stamp orientation before connection to
development boards and other circuits.
a. Like other IC’s, the BASIC Stamp should be inserted in a
specific orientation in relation to the development board
or circuit. Powering the circuit with an IC connected
backwards will likely damage the IC and/or other
components in the circuit. Most IC’s have some form of a
“pin 1 indicator” as do most IC sockets. This indicator
usually takes the form of a dot, a half-circle, or the
number 1 placed at or near pin 1 of the device.
The BS1-IC has a “1” and a half-circle indicator on the
backside of the module. Additionally, Figure 1.1 above
indicates the pin numbering and labels.
All BS2 series modules have a half-circle indicator on the
topside of the module (see Figure 1.13). This indicates
that pin number one is the first pin counterclockwise from
the notch. The socket that accepts this 24-pin module also