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SPECIFICATION SHEET

kit information

specifications

Grounding and bonding kits shall bond each rack to Secondary Bonding

Busbar (SBB) also known as Telecommunications Grounding Busbar

(TGB) using Telecommunications Equipment Bonding Conductor

(TEBC). Hardware kit shall bolt TEBC to SBB/TGB with 1/4” stainless

steel hardware. Each bolt requires a nut, flat washer on both sides,

and a Belleville washer on the bolt side of the stack up. TEBC shall be

bolted to rack with #12-24 thread-forming screws. Abrasive cleaning

pad shall remove oxidation from lug and mounting surfaces. Copper to

copper joint compound shall also be utilized to prep lug mounting sur-

faces. The front and back of each rack requires one ESD Port Kit and

ESD wrist strap. Bond SBB/TGB to electrical panel serving equipment

in telecommunications room.

StructuredGround

™

Telecommunications Room

Grounding and Bonding Kits deliver a complete

grounding solution, designed to exceed industry

standards for ensured electrical continuity and ease of

installation. Bonding of rack and equipment to SBB/TGB

and proper ESD protection is critical to the reliability and

safety needs of the physical infrastructure. Integrated

technology from Panduit addresses comprehensive

grounding and bonding needs to protect systems,

equipment, and personnel for optimum availability of

services and lower operational costs. As solution

architecture, a range of installation tooling, design

software, and services complement StructuredGround

™

Grounding System.

TEBC Kits:

Pre-terminated

jumper on both ends

– #6 AWG jumper

with 45° bent lug on

rack side to straight

lug on SBB/TGB.

TEBC Kits:

Pre-terminated

jumper on one end

only – #6 AWG

jumper with 45°

bent lug for

bonding to rack.

SBB/TGB Kits:

Pre-assembled with

brackets and insulators

– bar size 1/4” x 2”.

Compression Lugs for SBB/TGB:

Two-hole straight tongue

compression lug with window.

Armored Fiber Cable

Grounding Kits:

Pre-terminated jumper on both ends

– straight lug and terminal. Provided

with mechanical clamp and cover for

terminal and two each #12-24 and

M6 hex head thread-forming screws.

Summary of content (2 pages)

PAGE 1
StructuredGround™ Telecommunications Room Grounding and Bonding Kits for TIA-607-C Compliance specifications Related Products Grounding and bonding kits shall bond each rack to Secondary Bonding Busbar (SBB) also known as Telecommunications Grounding Busbar (TGB) using Telecommunications Equipment Bonding Conductor (TEBC). Hardware kit shall bolt TEBC to SBB/TGB with 1/4” stainless steel hardware.
PAGE 2
StructuredGround™ Telecommunications Room Grounding and Bonding Kits for TIA-607-C Compliance bill of materials (example): The following sample bill of materials and installation drawings are provided to assist you with ordering and kit combinations to meet your application needs.