Data Sheet

TBM-QCC307 Bluetooth Module Datasheet

TONLY ELECTRONICS HOLDINGS LIMITED Confidential

 600Pcs per every Vacuum packing

8.环保声明 Green Policy

This module can meet ROHS&REACH compliance.XXXX

9.推荐过炉温度 RECOMMENDED TEMPERATURE REFLOW PROFILE

The soldering profile depends on various parameters necessitating a set up for each

application. The data here is given only for guidance on solder re-flow. There are four zones:

1. Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.

2. Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the

flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out

gassing of the flux.

3. Reflow Zone - The peak temperature should be high enough to achieve good wetting but not

so high as to cause component discoloration or damage. Excessive soldering time can lead to

inter metallic growth which can result in a brittle joint.

4. Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give

a longer lasting joint. Typical rates will be 2-5°C/s.