Datasheet

Classification
No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 17
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
8.3. Flux
Use rosin-based flux. Do not use high-activity flux (the chlorine content is 0.2wt% or
more.)
8.4. Precaution for handling of substrate
Do not bend the board after soldering the product extremely.
(Example)
• Mounting place should be as far as possible
from the position which is closed to the break
line of board or the line of large holes of
board.
• When mounting other components, do not
bend the board extremely. If necessary, use
back-up pin (support pin) to prevent from
bending extremely.
• Do not break the board by hand. We recommend to use the machine or the jig to break it.
8.5. Precaution for soldering
Note that the product will be easily damaged by rapid heating, rapid cooling and local
heating.
Allow enough preheating so that the difference of soldering temperature and temperature
of surface of the part is 100
°C or less. This temperature difference shall be kept in rapid
cooling by immersion into solvent.
8.6. Recommendable reflow soldering
• Please measure temperature of terminals
and study solderability every type of boards,
before actual use.
• Please inquire of us when you use the
different conditions.
The product
Support pin
Board
Another chip
Vacuum nozzle
Temperature
Time
Preheating
Main
heating
Peak
<Eutectic solder> (Sn/Pb system et al.)
Condition Time
Preheating 140
o
C to 160
o
C 60s to 120s
Main
heating
200
o
C min. 30s to 40s
Peak 235
o
C ± 5
o
C 10s max.
<Lead-free solder> (Sn/Ag/Cu system et al.)
Condition Time
Preheating 150
o
C to 180
o
C 60s to 120s
Main
heating
230
o
C min. 30s to 40s
Peak 260
o
C max. 10s max.