Datasheet

Classification
No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 15
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
7. Mechanical Performance
Characteristics Specification Test method
7.1.1.
Bond strength of the
face plating
50 m
Ω max.
and no evidence of
mechanical damage.
Specimens shall be placed on testing board
that is glass-fabric based epoxy resin with
100 mm in length, 40 mm in width and 1.6
mm in thickness.
The testing board shall be supported at two
points 45 mm from its center with
mounting surface, and middle part of it’s
board shall be pressed at rate of 1 mm/s
until the deflection becomes 1 mm and
then the pressure shall be maintained for
30 s.
7.1.2.
Solderability
95 % coverage min. Specimens shall be tested by the following
conditions.
Test temperature of solder : 215
°C ± 5 °C
Dwell time in solder : 5 s
± 0.5 s
8. Precautions for mounting
8.1. Land pattern
Land pattern is shown in the figure below.
0.4
1.51
Land pattern
Unit: mm
2.2
0.5
0.4
3.8
0.6
0.6
0.65
0.65
8.2. Solder cream in reflow soldering
Printing pattern of solder cream is shown in the figure below.
Metal mask
opening pattern
Unit: mm
2.4
4.0
A
A
B
B
B
B
0.2
0.35
0.1
0.5
0.7
A
0.4
0.6
B
0.35
0.25
0.1