Datasheet

Classification
No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 14
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
6.4. Environmental performance
Characteristics Specification Test method
6.4.1.
Rapid change of
temperature
50 m
Ω max.
Specimens shall be tested for 700 cycles
continuously in accordance with the
following duty cycle.
* Prior to use, verify the performance,
reliability, etc. thoroughly, if you use the
board that is not glass-fabric based epoxy
resin.
6.4.2.
Load life in humidity
50 m
Ω max. Specimens shall be exposed at 60 °C ± 2 °C
and 90 % to 95 % relative humidity in a
humidity test chamber for 1000 h
+48
0
h.
During this time, the rated current shall be
applied intermittently for 1.5 h ON, 0.5 h
OFF.
6.4.3.
Endurance at 85
°C
50 m
Ω max. Specimens shall be exposed at 85 °C ± 2 °C
for 1000 h
+48
0
h. During this time, the
rated current shall be applied.
6.4.4.
Endurance at -40
°C
50 m
Ω max. Specimens shall be exposed at –40 °C ± 2 °C
for 1000 h
+48
0
h. During this time, the
rated current shall be applied.
6.4.5.
High temperature
exposure
50 m
Ω max. Specimens shall be exposed at 85 °C ± 2 °C
for 1000 h
+48
0
h.
6.4.6.
Low temperature
exposure
50 m
Ω max. Specimens shall be exposed at –40 °C ± 2 °C
for 1000 h
+48
0
h.
6.4.7.
Solvent resistance
No deterioration of protective
coatings
Specimens shall be immersed in a bath of
isopropyl alcohol completely for 5 min.
6.4.8.
Resistance to
soldering heat
50 m
Ω max. Specimens shall be immersed in 260 °C ± 5
°C solder (H63A) for 10 s ± 1 s, 2 times after
150
°C ± 5 °C pre-heat for 1 min.
Step Temperature Time
1
-40
°C
±
3 °C
40 min
± 3 min
2
room temperature
3 min max.
3
+85
°C
±
3 °C
40 min
± 3 min
4
room temperature
3 min max.