Datasheet

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Networks
E
1
X
2
B
3
E
4
1
5
0
6
C
7
1
8
0
9
3
10
J
11 12
Product Code
Thick Film
Resistor
Network
Number of
Terminals
10(EXBD,E,A)
16(EXBQ)
Circuit Configuration
Code
C
Common Terminal Position
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance Value
Resistance
Tolerance
J
Suffix for Special
Requirements
Dimension Code of
Chip Resistor Network
Code Dimensions
4.0 mm×2.1 mm
6.4 mm×3.1 mm
3.8 mm×1.6 mm
P
P
E
Center common circuit
(EXBD, EXBE)
Diagonal common circuit
(Terminal 5 and Terminal 10)
(EXBA)
D
E
A
Q
3.2 mm×1.6 mm
One side common circuit
(Terminal 16)
(EXBQ)
Diagonal common circuit
(Terminal 1 and Terminal 6)
(EXBA)
±5 %
Inch
1206
1608
2512
1506
No through hole
Through holes
Pull up resistors
0.4 mm pitch 0.635 mm pitch
EXBE10C EXBA10P
Direct placement on the bus line
IC IC
V
CC
IC IC
V
CC
IC IC
V
CC
Explanation of Part Numbers
Features
●
High density placing for digital signal circuits
· Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm × 1.6 mm × 0.45 mm, 0.5 mm pitch
· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
●
High speed mounting using conventional placing machine
●
Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
●
RoHS compliant
■
As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions,
Please see Data Files
[High density placing]
Chip Resistor Networks
Type: EXBD
EXBE
EXBA
EXBQ
Sep. 201402