Datasheet

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-7
Panasonic Electronic Devices Co., Ltd.
14. Tape and Reel Package
14-1. Physical Dimensions
Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
14-2. Carrier Tape Dimensions
Sprocket hole
Chip hole
P1
P0
P2
A
φ
D0
E
W
F
T
B
Chip resistor array
A B W F E
(mm) 1.20±0.10 2.20±0.10 8.00±0.20 3.50±0.05 1.75±0.10
P1 P2 P0 T φD0
(mm)
2.00±0.10 2.00±0.05 4.00±0.10 0.52±0.05
1.50
14-3. Specification
14-3-1. Taping
(1) When the test shall be operated with the below conditions, peel strength should be
0.049N
to 0.49N, should not have flash and tear after peeling.
<Test Method>
(2) Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip
and no break of carrier tape. However minimum bending radius shall be tested for 1
times.
+0.10
0
Peeling Direction
Top Tape
10°
Carrier Tape
Carrier ta
p
e
To
p
ta
p
e
Adhesive ta
p
e
Unit : mm
Min. 60.0
11.4 +/- 1.0
9.0 +/- 1.0
180.0 +0 / -3.0
13.0 +/- 1.0
Min. 60.0