Datasheet

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-6
Panasonic Electronic Devices Co., Ltd.
11. Storage method
If the product is stored in the following environments and conditions, the performance and
solderability may be badly affected. Avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, and NO
X.
(2) Storage in places exposed to direct sunlight.
(3) Storage in places outside the temperature range of 5 °C to 35 °C and humidity range of
45 %RH to 85 %RH.
(4) Storage over a year after our delivery (This item also applies to the case where the
storage method specified in item (1) to (3) has been followed.).
12. Laws and Regulations
(1) No ODCs or other ozone-depleting substances that are subject to regulation under the
Montreal Protocol are used in our manufacturing processes, including in the manufacture of
this product.
(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).
(3) All materials used in this product are existing chemical substances recognized under "lows
on examination of chemical substances and regulations of manufacturing and others."
(4) None of the materials used in this product contain the designated incombustible bromic
substances, PBBOs and PBBs.
(5) Please contact us to obtain a notice as to whether this product has passed inspection under
review criteria primarily based on Foreign Exchange and Foreign Trade Control Laws, and
appended table in the Export Control Laws.
13. Production Place
Production Country : Japan
Production Plant : Panasonic Electronic Devices Japan Co., Ltd..
Production Country : China
Production Plant : Panasonic Electronic Devices (Tianjin) Co., Ltd.(PEDTJ)