Datasheet

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-3
Panasonic Electronic Devices Co., Ltd.
6. Performance Specification
Specification
Item
Resistor Jumper
Test methods
DC resistance
DC resistance
value shall be
within the
specified
tolerance
Less than
50 mΩ
Measuring voltage: refer to JIS-C5201-1
At 20 °C, 65 %RH
Resistance TCR
10Ω to 1MΩ ±200×10
-6
/ °C
Temperature
coefficient
Chip jumper :
Less than 50 mΩ
Natural resistance change per temperature
degree centigrade.
R
2
- R
1
R
1
×(t
2
- t
1
)
R
1
: Resistance value at reference
temperature(t
1
)
R
2
: Resistance value at test
temperature(t
2
)
t
2
- t
1
= 100 °C, t
1
= 25 °C
Overload
±(2 %+0.1 Ω)
Less than
50 mΩ
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
However, the upper limit of the voltage in the
test shall be 100V.
In addition, the current applied to the jumper
in the test shall be 2A.
Dielectric
Withstanding
No evidence of flashover,
mechanical damage, arcing or
insulation breakdown.
A
C 100V between substrate and termination
for 1 minute.
Insulation
Resistance
Min. 1,000 MΩ
Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Specification
Item
Resistor Jumper
Test methods
No mechanical damage
Bend strength of
the face plating
±(1 %+0.05 Ω)
Less than
50 mΩ
Substrate: Glass epoxy(t = 1.0 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Solderability
Termination should be covered
uniformly with solder.
(min. 95 % coverage)
Resistors shall be dipped in the melted solder
bath at 235 °C ± 5 °C for 2 s ± 0.5 s. Flux shall
be removed from the surface of termination
with clean organic solvent.
TCR=