Datasheet

Light Touch Switches/EVQP0/Q2
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
F
W
E
Tape width=12.0 mm
Feeding hole
Chip pocket
Chip component
Tape running direction
0.3 mm max.
Switch
Test pole
Leaning angle range
90 °±4 °
(vertical direction)
Mounting surface
R0.1 mm±0.05 mm R0.1 mm±0.05 mm
2 mm Type 2.5 mm, 3.1 mm Type
φ3
–0.5
+0
φ4
–0
+0.5
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
● Embossed Carrier Taping
■ Recommended Reflow Soldering Conditions
Part No. Height A B W F E P1 P2 P0 D0 Dia t1 t2
EVQQ2
2.0
6.7±0.2 7.4±0.2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.30±0.05
2.2±0.2
2.5/3.1 3.2±0.2
EVQP0 2.5 2.8±0.2
‒0
Unit: mm
■ Recommended Shape of Test Pole ■ Recommended Operating Conditions
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.
Shouldasafetyconcernariseregardingthisproduct,pleasebesuretocontactusimmediately.
ANCTB12E-1 201709-Fd
Panasonic Corporation 2017
Panasonic Corporation
Electromechanical Control Business Division
–5–
industrial.panasonic.com/ac/e/
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1. ON at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
cs6ANCTB10104.indd9 17/10/059:06





