Datasheet
Light Touch Switches/EVQPL/3PL/5PL/PT
φ1.0
R0.2±0.05
for Reflow
soldering
type
0.3 mm max.
Switch
Mounting surface
Test pole
Leaning angle range
90 °±4 °
(
vertical direction
)
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
■ Recommended Operating Conditions
■ Recommended Shape of Test Pole
■ Recommended Reflow Soldering Conditions
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
Feeding hole
Chip component
Tape running direction
Chip pocket
F
W
E
Tape width=12.0 mm
● Embossed Carrier Taping
Unit: mm
Part No. Height ABWFEP
1
P
2
P
0
D
0
Dia. t
1
t
2
EVQPL
EVQ3PL
EVQ5PL
EVQPT
0.8/1.5 5.0±0.2 5.0±0.2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.35±0.1
1.0/1.7±0.2
–0
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.
Shouldasafetyconcernariseregardingthisproduct,pleasebesuretocontactusimmediately.
Panasonic Corporation
Electromechanical Control Business Division
–3–
industrial.panasonic.com/ac/e/
ANCTB121E 201803-Fd
Panasonic Corporation 2018
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1.0N at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.




