Datasheet
Light Touch Switches/EVQP2/P9/3P2
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
Feeding hole
Chip component
Tape running direction
Chip pocket
F
W
E
Tape width=12.0 mm
0.3 mm max.
Switch
Mounting surface
Test pole
Leaning angle range
90 ˚±4 ˚
(
vertical direction
)
φ3.3 to φ3.7
Middle Push
Travel Type
Short Push
Travel Type
φ3.0
■ Recommended Reflow Soldering Conditions
● Embossed Carrier Taping
Unit: mm
Part No. Height ABWFEP
1
P
2
P
0
D
0
Dia. t
1
t
2
EVQP2
EVQP9
EVQ3P2
2.1
2.5
6.0±0.2 4.7±0.2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.3±0.1 2.7±0.2
–0
■ Recommended Shape of Test Pole ■ Recommended Operating Conditions
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.
Shouldasafetyconcernariseregardingthisproduct,pleasebesuretocontactusimmediately.
Panasonic Corporation
Electromechanical Control Business Division
–6–
industrial.panasonic.com/ac/e/
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1. ON at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
ANCTB19E 201701-Fd
Panasonic Corporation 2017
ANCTB19E.indd6 17/01/139:07






