Datasheet
Light Touch Switches/EVPAV
General dimension tolerance : ± 0.1
( )dimensions are reference dimensions.
1
2
3
4
Circuit Diagram
1
2
3
4
1 These dimensions are
from the outer shape
to the center of push plate.
2 These dimensions are
from the center of datum A.
This product is designed to be smaller
than the conventional type, which lowered
the film peel off strength. Therefore please
avoid to apply force to a push plate from
side, or/and avoid set-knob to touch push
plate during insertion to a set-case.
Soldering thickness t=0.1±0.02
(1.63)1.95
2) 1.00±0.082) 1.00±0.08
1.93±0.15
0.3
0.650.65
(0.98)
2.8
A
(φ0.75)
φ0.6
2.3±0.2
0.9
(2.8)
(1.88)
0.65±0.15
2.00±0.15
1.50±0.05
PWB land pattern for reference
Push plate side
Push plate
Adhesive
0.975±0.200
1) 0.975±0.200
0.45±0.05
0.65±0.05
0.40±0.05
1.42±0.05
0.92±0.05
3.20±0.05
1)1.4±0.2
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
■ Dimensions in mm (not to scale)
EVPAV
*
Height from surface of PCB : 0.975 mm
Tape running direction
F
C
J
K
t
H
A
L
φG
D E
B
I
Tape width=8.0 mm
Feeding hole
Chip
pocket
● Embossed Carrier Taping
■ Recommended Reflow Soldering Conditions
Unit: mm
Part No. Height A B C D E F G H I J K L t
EVPAV 1.95 8.0±0.3 1.75±0.10 3.5±0.1 4.0±0.1 4.0±0.1 2.0±0.1 1.5
+0.1
3.1±0.2 2.8±0.2 1.35±0.20 2.7±0.2 (6.25) 0.3±0.1
‒0
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.
Shouldasafetyconcernariseregardingthisproduct,pleasebesuretocontactusimmediately.
Panasonic Corporation
Electromechanical Control Business Division
–2–
industrial.panasonic.com/ac/e/
ANCTB24E 201709-Fd
Panasonic Corporation 2017
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1.0N at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
cs6ANCTB10104.indd20 17/10/059:06


