Datasheet

Light Touch Switches/EVPAD
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
180
260
MAX.
150
230
90 to 30 40 to 10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
T
WA
B
E
C
D
r
t
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
F
W
E
Feeding hole
Chip component
Tape running direction
Chip pocket
Tape width=16.0 mm
t
3
t
2
1
The delivered carrier tape shape is either
1
or
2
.
Dimension
t
3
only applies to shape
2
.
2
0.5 max.
–0.4
+0
10.35
3.2
0.8
φ7
9.8
9.8
10.15
φ4.2
φ4.5
–0.1
+0.2
3.2
0.8
0.8
0.8
1.2±0.1
11.3±0.1
8.4±0.1
1.2±0.1
3.2±0.1
1.2±0.1
A4
A3
B2
A2
B1
A1
0.7
A1
B1
A2
A3
B2
A4
B1,B2
A1,A2,A3,A4
PWB land pattern for reference
4.7
LED implementation position
(Plastic projection)
LED implementation area
Circuit Diagram
(Precautions for pattern design)
✽ Note that the terminals are exposed at the sections shaded with " "
✽ Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance.
● Embossed Carrier Tap ing
■ Recommended Refl ow Soldering Conditions
Unit: mm
● Standard Reel Dimensions in mm (not to scale)
Item A B C D E
Rate (mm)
φ
380.0±2.0
φ
80.0±1.0
φ
13.0±0.5
φ
21.0±1.0 2.0±0.5
Item W T t r
Rate (mm) 17.5±0.5 21.5±1.0 — —
Part No. Height A B W F E P
1
P
2
P
0
D
0 Dia
t
1
t
2
t
3
EVPAD 4.6 10.7±0.2 10.7±0.2 16.0±0.3 7.5±0.1 1.75±0.10 12.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.40±0.05 4.8±0.2 5.8±2.0
_
0
■ Dimensions in mm (not to scale)
EVPADK04K
(Embossed Taping)
Oct. 201200