Datasheet

Product Specification
EGC-RF-1-0
Electric Double Layer Capacitor RF series
11
6. Heat stress during soldering
Excessive heat stress may result in the deterioration of the electrical characteristics of the capacitor, loss of
air-tightness, and electrolyte leakage due to the rise in internal pressure.
•If the tip of the soldering iron touches the capacitor's external sleeve, the sleeve will melt or break.
•Use the general reference chart to set soldering temperature and time.
In case of soldering by soldering iron
In use the soldering iron (30W or under), solder at the iron tip temperature not more than 350°C within 4seconds.
Do not touch the iron tip to the body of Gold Capacitor.
7. Brown extraction
A brown extraction might be caused in the sealing part depending on use conditions. This extraction is insulation.
Therefore, it doesn't have the influence in the electric characteristic.
Panasonic Electronic Devices Co.,Ltd.
Pre–heat temp : less than 110°C
(Print board surface temp.)
less than 100°C
(Component unit temp.)
Pre-heat time: with in 60sec.
Print board thickness:
more than 0.8 mm
Recommended
range
Solder bath temperature [°C]
Dip time (S)
0
2
4
6
8
200
220
240
260
General specified range