Datasheet

1 of
4
28 Apr, 2004
Panasonic Electronic Devices Co., Ltd.
APPROVAL
Y.Sakaguchi
CHECK
S.Endoh
DESIGN
T.Shi n r iki
Note ; 01 Apr, 2005 Change the company name.
Previous : Matsushita Electronic Components Co., Ltd.
New : Panasonic Electronic Devices Co.
,
Ltd.
CLASSFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SV037E
Multilayer Ceramic Chip Capacitor
Ta
p
ed and Reeled Packa
g
in
g
S
p
ecifications
(
Low Profile T
yp
e
)
1.
Scope
This specification applies to taped and reeled packing for Multilayer Ceramic Chip Capacitors
(Low Profile Type).
2.
Applicable Standards
EIAJ (Electric Industries Association of Japan) Standard EIAJ RC-1009B
JIS (Japanese Industrial Standard) Standard JIS C 0806
3.
Packing Specification
3- 1.Structure and Dimensions
Paper taping packaging is carried out according the following diagram
(1)Carrier tape : Shown in Fig. 4.
(2)Reel : Shown in Fig. 5.
(3)Packaging : We shall pack suitably in order prevent damage during transportation or storage.
3- 2.Packing Quantity
Carrier-Tape Quantity (pcs./reel)
φ
180mm Reel
Type
(EIA)
Thickness of
Capacitor(mm)
Material Taping Pitch Packaging
Code
Quantity
12type (0805)
0.85+/-0.10 Paper Taping 4mm V 4000
0.85+/-0.10 Paper Taping 4mm V 4000
13type (1206)
1.15+/-0.10 Embossed Taping 4mm F 3000
23type (1210)
0.85+/-0.10 Embossed Taping 4mm F 3000
※ Explanation of Part Numbers (Example)
ECJ G V B 1C 105 K
Packaging Code
3- 3.Marking on the Reel
The following items are described in the side of a reel in English at least.
(1)Part Number
(2)Quantity
(3)Lot Number
(4)Place of origin
3- 4.Structure of Taping
(1) The direction of winding of taping on the reel shall be in accordance with the following diagram.
Fig. 1 Paper Taping