Datasheet

8 of 9
Apr. 1, 2008
CLASSIFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SS018E
Multilayer Ceramic Chip Capacitor
Common S
p
ecification
(
Precautions for Use
)
Note ;
(c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to
those of rosin soldering flux.
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate the strength of the terminal electrodes or cause cracking
in the solder and/or ceramic bodies of the Capacitors due to vibration of the PC boards.
Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 minutes max.
3-5-3. Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may cause the same results as insufficient cleaning due to the high
density of liberated halogen.
3- 6.Inspection Process
When mounted PC boards are inspected with measuring terminal pins, abnormal and excess mechanical stress
shall not be applied to the PC board or mounted components, to prevent failure or damage to the devices.
(1) Mounted PC boards shall be supported by an adequate number of supporting pins with bend settings of 90 mm
span 0.5mm max.
(2) Confirm that the measuring pins have the right tip shape, are equal in height and are set in the correct positions.
The following figures are for your reference to avoid bending the PC board.
Prohibited setting Recommended setting
Bending of PC board
3- 7.Protective Coating
When the surface of a PC board on which the Capacitors have been mounted is coated with resin to protect against
moisture and dust, it shall be confirmed that the protective coating which is corrosive or chemically active is not
used, in order that the reliability of the Capacitors in the actual equipment may not be influenced. Coating materials
that expand or shrink also may lead to damage to the Capacitor during the curing process.
3- 8.Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stress such as bending or torsion
shown below can cause cracking in the Capacitors.
(2) Dividing/Breaking of the PC boards shall be done carefully at moderate
speed by using a jig or apparatus to prevent the Capacitors on the boards
from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
When PC boards are broken or divided, loading points should be close to the jig to minimize the extent of
the bending
Also, planes with no parts mounted on should be used as plane of loading, which generates a compressive
stress on the mounted plane, in order to prevent tensile stress induced by the bending, which may cause cracks
of the Capacitors or other parts mounted on the PC boards.
Separated
Check pin
Supporting
pin
Check pin
Torsion
PC board
splitting jig
V-groove
PC board
Outline of Jig
Recommended dividing
V-groove
PC board
Load position
Load direction
Prohibited dividing
Chip component
Load position
PC board
V-groove
Load direction
Bending