Datasheet

7 of 9
Apr. 1, 2008
CLASSIFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SS018E
Multilayer Ceramic Chip Capacitor
Common S
p
ecification
(
Precautions for Use
)
Note ;
3-4-2. Hand soldering
Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses
inside the Capacitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be observed;
・The temperature of the soldering tips should be controlled with special care.
・The direct contact of soldering tips with the Capacitors and/or terminal electrodes should be avoided.
・Dismounted Capacitors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering :
φ 1.0mm or below Thread eutectic solder with soldering flux* in the core.
*Rosin-based and non-activated flux is recommended.
(b) Preheating:
The Capacitors shall be preheated so that the “Temperature Gradient” between the devices and the tip
of soldering iron is 150℃ or below.
(c) Temperature of Iron tip: 300℃ max.
(The required amount of solder shall be melted in advance on the soldering tip.)
(d) Gradual Cooling:
After soldering, the Capacitors shall be cooled gradually at room ambient temperature.
Recommended profile of Hand Soldering [Ex.]
〈Allowable temperature difference ∆T〉
Siz e Te m p. Tol.
0201 to 1206
0508, 0612, 0504
∆T≦ 150 °C
1210 ∆T≦ 130 °C
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating, by following the conditions below:
(a) Soldering iron tip shall never directly touch the ceramic dielectrics and terminal electrodes of the
Capacitors.
(b) The lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the
terminal electrodes of the Capacitor for soldering.
Conditions of Hand soldering without preheating
Condition
Chip size 0201 to 0805, 0508, 0504 1206 to 1210 , 0612
Temperature of soldering iron 270 °C max. 250 °C max.
Wattage 20W max.
Shape of soldering iron tip
φ 3mm max.
Soldering time with soldering iron 3s max.
3- 5.Post Soldering Cleaning
3-5-1. Cleaning solvent
Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent. This may deteriorate
the electrical characteristics and reliability of the Capacitors.
3-5-2. Cleaning conditions
Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Capacitors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance in the residues of the soldering flux to cause the metal of terminal electrodes to
corrode.
(b) The halogen substance in the residue of the soldering flux on the surface of the Capacitors may change
resistance values.
60 to 120 s
Soldering
G
radual
cooling
Preheating
3 s max
.
∆T