Datasheet

6 of 9
Apr. 1, 2008
CLASSIFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SS018E
Multilayer Ceramic Chip Capacitor
Common S
p
ecification
(
Precautions for Use
)
Note ;
3- 3.Selection of Soldering Flux
Soldering flux may seriously affect the performance of the Capacitors. The following shall be confirmed before use.
(1) The soldering flux should have a halogen based content of 0.1 wt. % (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash the Capacitors sufficiently because the soldering flux residue
on the surface of PC boards may deteriorate the insulation resistance on the Capacitor’s surface.
3- 4.Soldering
3-4-1. Reflow soldering
The reflow soldering temperature conditions are each temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling. Large temperature difference caused by rapid heat application to the Capacitors
may lead to excessive thermal stresses, contributing to the thermal cracks. The Preheating temperature
requires controlling with great care so that tombstone phenomenon may be prevented.
Temperature Period or Speed
①
Preheating 140 to 180
℃
60 to 120 s
②
Temp. rise
Preheating temp. to Peak temp.
2 to 5
℃
/s
③
Heating 220
℃
min.
60 s max.
④
Peak 260
℃
max.
10 s max.
⑤
Gradual cooling Peak temp. to 140
℃
1 to 4
℃
/s
The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause
defects such as the thermal cracks, etc.
When the Capacitors are immersed into a cleaning solvent, confirm that the surface temperature of the devices
does not exceed 100℃.
Performing reflow soldering twice under the conditions shown in the figure above [Recommended profile of
Reflow soldering (EX)] will not cause any problems. However, pay attention to the possible warp and bending
of the PC board.
Recommended profile of Reflow soldering (Ex.)
〈 Allowable temperature difference ∆T〉
Siz e Te m p. Tol.
0201 to 1206
0508, 0612, 0504
∆T≦ 150 °C
1210 ∆T≦ 130 °C
Temperature (℃)
Time
60 to 120 s
60 s max.
220
260
ΔT
180
140
①Preheating
②Temp . r i s e
③Heating
⑤Gradual
cooling
④Peak