Datasheet

5 of 9
Apr. 1, 2008
CLASSIFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SS018E
Multilayer Ceramic Chip Capacitor
Common S
p
ecification
(
Precautions for Use
)
Note ;
2-2-5. Mounting Density and Spaces
If components are arranged in too narrow spaces, the
components are affected by Solder bridges and
Solder balls. Each space between components
should be carefully determined.
3. Precautions for Assembly
3- 1.Storage
(1) The Capacitors before mounting on PCB shall be stored between 5 - 40°C and 20 - 70% RH, not under severe
conditions of high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains corrosive gasses (hydrogen sulfide, sulfurous acid,
hydrogen chloride and ammonia, etc.), the solderability of terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating and/or exposed to direct sunlight will cause deformed tapes
and reels. and component sticking to tapes, both of which can result in mounting problems.
(3) Do not store components longer than 6 months. Check the solderability of products that have been stored for
more than 6 months before use.
(4) The Capacitors of high dielectric constant series (Class 2, Characteristic B,X7R,X5R and F,Y5V) change in
capacitance with the passage of time, “Capacitance aging”, due to the inherent characteristics of ceramic
dielectric materials. The changed capacitance can be recovered by heat treatment to each initial value at the
time of shipping. (See 2. Operating Condition and Circuit Design, 2-1-7. Capacitance aging)
(5) When the initial capacitance is measured, the Capacitors shall be heat-treated at 150+0/-10℃ for 1 hour and
then subjected to ordinary temperature and humidity for 48±4 hours before measuring the initial value.
3- 2.Chip Mounting Consideration
(1) When mounting the Capacitors/components on a PC board, the capacitor bodies shall be free from excessive
impact loads such as mechanical impact or stress in the positioning, pushing force and displacement of vacuum
nozzles at the time of mounting.
(2) Maintenance and inspections for Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Capacitor is cracked by an excessive force at the
time of mounting.
The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after
correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle at the time of mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. The typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center at the time of mounting is not too low.
(4) The closing dimensions of positioning chucks shall be controlled and the maintenance, checks and replacement
of positioning chucks shall be regularly performed to prevent chipping or cracking of the Capacitors caused by
mechanical impact at the time of positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed
0.5mm at 90mm span. The PC board shall be supported by means of adequate supporting pins.
Prohibited mounting Recommended mounting
Single surface
mounting
Double surface
mounting
Crack
Supporting
pin
The supporting pin must not
be necessarily positioned
beneath the capacitor
.
Separation
of solder
Crack
Supporting
pin