Datasheet

4 of 9
Apr. 1, 2008
CLASSIFICATION
SPECIFICATIONS
No.
SUBJECT
PAGE
DATE
151S-ECJ-SS018E
Multilayer Ceramic Chip Capacitor
Common S
p
ecification
(
Precautions for Use
)
Note ;
2-2-3. Utilization of Solder Resist
The application of solder resist is effective in preventing solder bridges and controlling the amount of solder on
PC boards.
(1)Solder resist shall be utilized to equalize the amounts of solder on both sides.
(2)Solder resist shall be used to divide the pattern for the following cases;
･Components are arranged closely.
･The Capacitor is mounted near a component with lead wires.
･The Capacitor is placed near a chassis.
See the table below.
Prohibited Applications and Recommended Applications
Prohibited applications Improved applications by pattern division
Mixed mounting
with a component with
lead wires
The lead wire of
a component with
lead wires
Sectional view
Solder resist
Sectional view
Arrangement
near chassis
Chassis
Solder (ground solder)
Sectional view
Solder resist
Sectional view
Retrofitting of
Component with lead
wires
Soldering iron Lead wire of
Retrofitted
component
Sectional view
Solder resist
Sectional view
Lateral arrangement Land Portion to be
excessively
soldered
Solder resist
2-2-4. Component Layout
The Capacitors / components shall be placed on the PC board such that both electrodes are subjected to
uniform stresses, or to position the component electrodes at right angles to the grid glove or bending line. This
should be done to avoid cracking the Capacitors from bending the PC board after or during placing/mounting on
the PC board.
(1) To minimize mechanical stress caused by warp or bending of a PC board, please follow the recommended
Capacitor layout below.
Prohibited layout Recommended layout
Warp of
Circuit board
Lay out the Capacitor
sideways against the
stressing direction
(2) The following drawing is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Capacitors.
(3) The magnitude of mechanical stress applied to
the Capacitors when the circuit board is divided is
in the order of push back < slit < V-groove <
perforation.
Also take into account the layout of the
Capacitors and the dividing/breaking method.
A
B
C
E
D
Slit
Magnitude of stress A＞B＝C＞D＞E
Perforation