Datasheet

ManualsBrandsPANASONIC ManualsCapacitorsCeramic capacitor SMD 1206 4.7 µF 16 V 10 % (Ø x L) 7 mm x 3.2 mm 1 pc(s)

Summary of content (22 pages)

PAGE 1
PAGE 2
CLASSIFICATION SUBJECT No. 151S-ECJ-KMS45E PAGE 1 of 1 DATE Aug 28, 2008 SPECIFACATION Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N:ECJHVB1C475K) Individual Specification 1. Scope This specification applies to Low Profile type Multilayer Ceramic Chip Capacitors (EIA 1206), Temp. Char:X5R, Rated voltage DC16 V , Nominal Capacitance 4.7 µF. 2. Style and Dimensions W Table 1 T Symbol Dimensions(mm) L 3.2 +/- 0.2 W 1.6 +/- 0.2 T 0.85 +/- 0.10 L1,L2 0.6 +/- 0.3 L1 L L2 3.
PAGE 3
CLASSIFICATION SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification No. 151S-ECJ-KGS45E PAGE 1 of 7 DATE Aug 28, 2008 1. Information 1- 1.Applicable laws and regulations (1) Any ozone-depleting substances listed in the Montreal Protocol are not used in the manufacturing processes for parts and materials used in this product. (2) PBB and PBDE are intentionally excluded from materials used in this product.
PAGE 4
CLASSIFICATION No. 151S-ECJ-KGS45E PAGE SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification 3- 3.Nominal Capacitance (6) The Nominal Capacitance value is expressed in pico farads(pF) and is identified by a three-digit number ; the first two digit represent significant figures and the last digit specifies the number of zero to follow. 2 of 7 DATE Symbol (Ex.) 105 475 106 Aug 28, 2008 Nominal Cap.
PAGE 5
CLASSIFICATION SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification No. 151S-ECJ-KGS45E PAGE 3 of 7 DATE Aug 28, 2008 Table 2 No Contents Performance Test Method 1 Appearance There shall be no defects which affect the life and use. With a magnifying glass (3 times). 2 Dimensions Shown in Individual Specification. With slide calipers and a micrometer.
PAGE 6
CLASSIFICATION No. 151S-ECJ-KGS45E PAGE SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification 4 of 7 DATE Aug 28, 2008 Table 2 No Performance Test Method 9 Bending Strength Appearance Capacitance There shall be no cracks and other mechanical damage. Temp. Change from the value Char. before test. X5R Within +/- 12.5 % After soldering capacitor on the substrate 1 mm of bending shall be applied for 5 seconds.
PAGE 7
CLASSIFICATION SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification No. 151S-ECJ-KGS45E PAGE 5 of 7 DATE Aug 28, 2008 Table 2 No 13 Contents Temperature cycle Performance Appearance There shall be no cracks and other mechanical damage. Capacitance Temp. Char. X5R tan δ I.R. Withstand voltage Change from the value before test. Within +/- 7.5 % Shall meet the specified initial value.
PAGE 8
CLASSIFICATION SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification No. 151S-ECJ-KGS45E PAGE 6 of 7 DATE Aug 28, 2008 Table 2 No 16 Contents High Temperature Resistant Loading Performance Appearance There shall be no cracks and other mechanical damage. Capacitance Temp. Char. X5R tan δ 0.15 max. I.R. 50/C MΩ min. (C : Nominal Cap. in µF) Change from the value before test. Within +/- 12.
PAGE 9
CLASSIFICATION No. 151S-ECJ-KGS45E PAGE SPECIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 1206) Low Profile type (P/N : ECJHVB1C475K) Common Specification Fig. 2 7 of 7 DATE Aug 28, 2008 Testing jig Table 4 Size(EIA) A B C 1206 2.2 5.0 2.0 Unit : mm Material : Glass epoxy board Thickness : 1.6 mm :Copper foil (0.035 mm thick) :Solder resist Fig. 3 Testing jig Table 5 Size(EIA) A B C 1206 2.2 5.0 2.0 Unit : mm Material : Glass epoxy board Thickness : 1.
PAGE 10
CLASSIFICATION SUBJECT No. 151S-ECJ-SS018E PAGE SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 1 of 9 DATE Apr. 1, 2008 1.
PAGE 11
CLASSIFICATION SUBJECT SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) No. 151S-ECJ-SS018E PAGE 2 of 9 DATE Apr. 1, 2008 Capacitance change vs. DC voltage DC voltage (V) 2-1-7. Capacitance aging The ceramic dielectrics of the Capacitors (Class 2) have capacitance aging.
PAGE 12
CLASSIFICATION No. 151S-ECJ-SS018E PAGE SPECIFICATIONS SUBJECT Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 3 of 9 DATE Apr. 1, 2008 2-2-2. Design of Land Pattern (1) Recommended land dimensions are shown below for proper amount of solder to prevent cracking at the time of excessive stress to the Capacitors due to increased amount of solder. { Recommended land dimensions (Ex.
PAGE 13
CLASSIFICATION SUBJECT No. 151S-ECJ-SS018E PAGE SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 4 of 9 DATE Apr. 1, 2008 2-2-3. Utilization of Solder Resist The application of solder resist is effective in preventing solder bridges and controlling the amount of solder on PC boards. (1)Solder resist shall be utilized to equalize the amounts of solder on both sides.
PAGE 14
CLASSIFICATION SUBJECT No. 151S-ECJ-SS018E PAGE SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 5 of 9 DATE Apr. 1, 2008 2-2-5. Mounting Density and Spaces If components are arranged in too narrow spaces, the components are affected by Solder bridges and Solder balls. Each space between components should be carefully determined. 3. Precautions for Assembly 3- 1.
PAGE 15
CLASSIFICATION SUBJECT SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) No. 151S-ECJ-SS018E PAGE 6 of 9 DATE Apr. 1, 2008 3- 3.Selection of Soldering Flux Soldering flux may seriously affect the performance of the Capacitors. The following shall be confirmed before use. (1) The soldering flux should have a halogen based content of 0.1 wt. % (converted to chlorine) or below. Do not use soldering flux with strong acid.
PAGE 16
CLASSIFICATION SUBJECT SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) No. 151S-ECJ-SS018E PAGE 7 of 9 DATE Apr. 1, 2008 3-4-2. Hand soldering Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the Capacitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should be observed; ・The temperature of the soldering tips should be controlled with special care.
PAGE 17
CLASSIFICATION SUBJECT No. 151S-ECJ-SS018E PAGE SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 8 of 9 DATE Apr. 1, 2008 (c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering flux.
PAGE 18
CLASSIFICATION SUBJECT No. 151S-ECJ-SS018E PAGE SPECIFICATIONS Multilayer Ceramic Chip Capacitor Common Specification ( Precautions for Use) 9 of 9 DATE Apr. 1, 2008 3- 9.Mechanical Impact (1) The Capacitors shall be free from any excessive mechanical impact. The Capacitor body is made of ceramics and may be damaged or cracked if dropped. Never use a Capacitor which has been dropped; their quality may be impaired and failure rate increased.
PAGE 19
CLASSFICATION SUBJECT No. SPECIFICATIONS Multilayer Ceramic Chip Capacitor Taped and Reeled Packaging Specifications (Low Profile Type) 151S-ECJ-SV037E PAGE DATE 1 of 4 28 Apr, 2004 1. Scope This specification applies to taped and reeled packing for Multilayer Ceramic Chip Capacitors (Low Profile Type). 2. Applicable Standards EIAJ (Electric Industries Association of Japan) Standard EIAJ RC-1009B JIS (Japanese Industrial Standard) Standard JIS C 0806 3. Packing Specification 3- 1.
PAGE 20
CLASSFICATION SUBJECT No. SPECIFICATIONS Multilayer Ceramic Chip Capacitor Taped and Reeled Packaging Specifications (Low Profile Type) PAGE DATE 151S-ECJ-SV037E 2 of 4 28 Apr, 2004 Fig. 2 Embossed Taping (2) The specification of the leader and empty portion shall be in accordance with the following diagram. Fig. 2 Leader Part and Taped End 100mm min. 160mm min. 4. Efficiency 4- 1.Breakage strength of the tape : 10N or more. 4- 2.Peel strength of the cover tape (refer to the following figure).
PAGE 21
CLASSFICATION SUBJECT SPECIFICATIONS Multilayer Ceramic Chip Capacitor Taped and Reeled Packaging Specifications (Low Profile Type) No. PAGE DATE 151S-ECJ-SV037E 3 of 4 28 Apr, 2004 （ｂ）Embossed Taping 4.3 Barrs on tape There shall be no barrs preventing suction when products are taken out. 4.4 Missing of products The missing of products shall be 0.1% or less per reel and there shall be no continuous missing of products. 4.
PAGE 22
CLASSFICATION SUBJECT SPECIFICATIONS Multilayer Ceramic Chip Capacitor Taped and Reeled Packaging Specifications (Low Profile Type) No. PAGE DATE 151S-ECJ-SV037E 4 of 4 28 Apr, 2004 (b) 13 and 23 type: 4mm chip taping pitch for Embossed taping. Code Dimension Ｗ 8.0 +/- 0.2 Ｆ 3.50 +/- 0.05 Ｅ 1.75 +/- 0.10 Ｐ１ 4.0 +/- 0.1 Ｐ２ 2.00 +/- 0.05 Ｐ０Ｄ０ 4.0 +/- 0.1 φ1.5 +0.1/-0 Type(EIA) 13type (1206) 23type (1210) A 1.9 +/- 0.2 2.8 +/- 0.2 B 3.5 +/- 0.2 3.5 +/- 0.2 Code Ｄ１ φ1.1+/- 0.