Data Sheet
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
Cautions for Use of Solid State Relays
Panasonic Corporation 2020
Noise and surge protection at the output side
1) Phototriac coupler and AQ-H
The gure below shows an ordinary triac drive circuit. Please add
a snubber circuit or varistor, as noise/surge on the load side could
damage the unit or cause malfunctions.
Typical circuits are shown below.
<Phototriac coupler SOP4 and DIP4 types>
U
4
32
1
Load
<Phototriac coupler DIP6 type>
U
3 4
2
61
Load
<AQ-H>
Note: Connection of an external resister, etc.,
to terminal No. 5 (gate) is not necessary.
U
Load
5
6
8
2
4
3
1
2) SSR
(1) AC output type
A high noise surge voltage applied to the SSR load circuit can
cause malfunction or permanent damage to the device. If such
a high surge is anticipated, use a varistor across the SSR
output.
Load
Load power
supply
SSR
1
2
Varistor
V
(2) DC output type
If an inductive load generates spike voltages which exceed the
absolute maximum rating, the spike voltage must be limited.
Typical circuits are shown below.
SSR
Load
Load power supply
Load power supply
SSR
Load
V
3) Clamp diode and snubber circuit can limit spike voltages at
the load side. However, long wires may cause spike voltages
due to inductance. It is recommended to keep wires as short
as possible to minimize inductance.
4) Output terminals may become conductive although the input
power is not applied, when a sudden voltage rise is applied
to it even when the relay is o. This may occur even if
voltage rise between terminals is less than the repetitive
peak OFF-state voltage. Therefore, please perform sucient
tests with actual conditions.
5) When controlling loads in which the voltage and current
phases dier, a sudden voltage rise is applied during turn-
o, and the triac sometimes does not turn o. Please
conduct sucient tests using actual equipment.
6) When controlling loads using zero-cross voltage types in
which the voltage and current phases dier, the triac
sometimes does not turn on regardless of the input state, so
please conduct sucient tests using actual equipment.
Cleaning (for PC board mounting type)
Cleaning the solder ux should use the immersion washing with an
organic solvent. If you have to use ultrasonic cleaning, please adopt
the following conditions and check that there are no problems in the
actual usage.
Frequency : 27 to 29kHz
Ultrasonic output: No greater than 0.25W/cm
2
(Note)
Cleaning time : 30s or less
Cleanser used : Asahiklin AK-225
Others : Float PC board and the device in the cleaning
solvent to prevent from contacting the ultrasonic
vibrator.
Note: Applies to unit area ultrasonic output for ultrasonic baths
Notes for mounting (for PC board mounting type)
1) When dierent kinds of packages are mounted on PC board,
temperature rise at soldering lead is highly dependent on
package size. Therefore, please set the lower temperature
soldering condition than the conditions of item “14.
Soldering”, and conrm the temperature condition of actual
usage before soldering.
2) When mounting condition exceeds our recommendation, the
device characteristics may be adversely aected. It may
occur package crack or bonding wire breaking because of
thermal expansion unconformity and resin strength
reduction. Please contact our sales oce about the propriety
of the condition.
3) Please conrm the heat stress by using actual board
because it may be changed by board condition or
manufacturing process condition
4) Solder creepage, wettability, or soldering strength will be
aected by the mounting condition or used soldering type.
Please check them under the actual production condition in
detail.
5) Please apply coating when the device returns to a room
temperature.
ASCTB400E 202003
ー 9 ー