Datasheet

Version 1.0 (not for new design) SFH 9202
2012-08-17 11
Recommended Solder Pad
Empfohlenes Lötpaddesign
JEDEC Level 4
Solder resist
Lötstopplack
Cu-area >5 mm
Cu-Fläche >5 mm
2
OHPY0030
3.9 (0.154)
1.2 (0.047)
1.27 (0.050)
0.6 (0.024)
1.27 (0.050)
2
Paddesign
Wärmeableitung
for improved
für verbesserte
Padgeometrie
Heat dissipation