Datasheet

2006-01-20 10
LS R976, LO R976, LY R976
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil (nach CECC 00802)
IR Reflow Soldering Profile (acc. to CECC 00802)
IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)
OHLA0685
0:00
0
T
t
˚C
min
50
100
150
200
250
0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 5:30
2-3 K/s
2-3 K/s
T = 183 ˚C = 70 s t
max
T
= 245 ˚C
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min