Datasheet

Data Sheet 6 1999-06-07
LG R971, LO R971, LY R971
Opto Semiconductors
Empfehlung Lötpaddesign Infrarot/Vapor-Phase Reflow-Lötung
Recommended Pad Infrared Vapor-Phase Reflow-Soldering
Empfohlenes Lötprofil
nach CECC 00802 für Infrarot/Vapor-Phase Reflow-Lötung
Recommended Soldering Profile
acc. to CECC 00802 for Infrared Vapor-Phase Reflow-Soldering
1.2 0.9 1.2
1.2
OHAP0607
OHLA0685
0:00
0
T
t
C
min
50
100
150
200
250
0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 5:30
2-3 K/s
2-3 K/s
T = 183 ˚C = 70 s t
max
T
= 245 ˚C