Datasheet

2011-09-05 Released 1.0 14
LT G6SP
Reflow Soldering Profile
Reflow Lötprofil
Preconditioning: JEDEC Level 2 acc. to J-STD-020D.01
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profil-Charakteristik
Profile Feature
Ramp-up Rate to Preheat*
)
25 ˚C ≤ T ≤ 150 ˚C
2 3 K/s
Time from T
Smin
to T
Smax
150 ˚C ≤ T
S
≤ 200 ˚C
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
23
245 260
36
Time
25 ˚C ≤ T ≤ T
P
Time within 5 ˚C of the specified peak
temperature T
P
- 5 K
Ramp-down Rate*
T
P
≤ T ≤ 100 ˚C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ΔT/Δt: Δt max. 5 s; fulfillment for the whole T-range
Ramp-up Rate to Peak*
)
T
Smax
≤ T ≤ T
P
Liquidus Temperature
Peak Temperature
Time above Liquidus temperature
Symbol
Symbol
Einheit
Unit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
˚C
˚C
480