Datasheet

2012-06-15 10
LS M670, LO M670, LY M670, LG M670, LP M670
Empfohlenes Lötpaddesign
8) 9) Seite 15
IR Reflow Löten
Recommended Solder Pad
8) 9) page 15
IR Reflow Soldering
OHLPY978
Paddesign
for improved
heat dissipation
Cu-area > 16 mm
Cu-Fläche > 16 mm
Wärmeableitung
Padgeometrie
für verbesserte
Lötstopplack
Solder resist
0.8 (0.031)
2.8 (0.110)
1 (0.039)
2
2
2.8 (0.110)
0.8 (0.031)
1 (0.039)