Datasheet

2013-06-19 14
Version 1.2 LCW W5AM
Recommended Solder Pad
7) page 21
Reflow soldering
Empfohlenes Lötpaddesign
7) Seite 21
Reflow-Löten
Solder resist
Bare Copper
Freies Kupfer
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHPY3637
1 (0.039)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
12.0 (0.472)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)
1 (0.039)
Attention:
Anode and
Heatsink are
electrically
connected
Achtung:
Anode und
Heatsink sind
elektrisch
verbunden