Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 950nm 1.5A 2.8V SMD

SFH 4775S

Version 1.0 | 2018-11-06

Produktdatenblatt | Version 1.1

www.osram-os.com

Applications

SFH 4775S

SYNIOS

P2720

IR SYNIOS P2720 (940 nm) - 120°

— CCTV Surveillance — Eye Tracking

Features:

— Package: clear silicone

— Corrosion Robustness Class: 3B

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— IR lightsource with high e󰘲ciency

— Double stack emitter

— Low thermal resistance (Max. 9 K/W)

— Centroid wavelength 940 nm

Ordering Information

Type Total radiant 󰘱ux

Total radiant 󰘱ux

Ordering Code

typ.

= 1000 mA; t

= 10 ms I

= 1000 mA; t

= 10 ms

SFH 4775S 900 ... 1800 mW 1,150 mW Q65112A7448

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4775S SFH 4775S SYNIOS ® P2720 IR SYNIOS P2720 (940 nm) - 120° Applications ——CCTV Surveillance ——Eye Tracking Features: ——Package: clear silicone ——Corrosion Robustness Class: 3B ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——IR lightsource with high efficiency ——Double stack emitter ——Low thermal resistance (Max.
PAGE 2
SFH 4775S Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Junction temperature Tj max. 145 °C Forward current IF max. 1500 mA Surge current tp ≤ 1.5 ms; D = 0.005 IFSM max. 3A Reverse current 2) IR max. 200 mA Power consumption Ptot max. 5800 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max.
PAGE 3
SFH 4775S Characteristics IF = 1000 mA; tp = 10 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 37 nm Half angle φ typ. 60 ° Dimensions of active chip area LxW typ. 1x1 mm x mm Rise time (10% / 90%) IF = 3 A; RL = 50 Ω tr typ. 11 ns Fall time (10% / 90%) IF = 3 A; RL = 50 Ω tf typ. 14 ns Forward voltage VF typ. max. 2.8 V 3.6 V Forward voltage IF = 1.
PAGE 4
SFH 4775S Brightness Groups Group Total radiant flux 1) IF = 1000 mA; tp = 10 ms min. Φe Total radiant flux 1) IF = 1000 mA; tp = 10 ms max. Φe EB2 900 mW 1250 mW FA1 1000 mW 1400 mW FA2 1120 mW 1600 mW FB1 1250 mW 1800 mW Only one group in one packing unit (variation lower 1.6:1). Relative Spectral Emission 4), 5) Ie,rel = f (λ); IF = 1000 mA; tp = 10 ms OHF04133 100 I rel % 80 60 40 20 0 800 850 900 950 nm 1050 λ 4 Version 1.
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SFH 4775S Radiation Characteristics 4), 5) Ie,rel = f (φ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ Relative Total Radiant Flux 4), 5) IF = f (VF); single pulse; tp = 100 µs OHF05693 101 Φe Φe (1 A) 0.1 4), 5) Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs [ ] 1 120˚ 100 10-1 0.01 10-2 10-3 10-4 2.0 2.5 1.5 5 Version 1.0 | 2018-11-06 3.0 3.
PAGE 6
SFH 4775S Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TS); RthJS = 9.0 K / W IF = f (tp); duty cycle D = parameter; TS = 85°C IF OHF05711 2.0 A IF 3.5 A 3.0 1.5 OHF05692 t D = TP tP IF T D= 2.5 1.0 2.0 0.5 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 1.5 0 25 50 75 100 ˚C 150 TS 6 Version 1.0 | 2018-11-06 1.
PAGE 7
SFH 4775S Dimensional Drawing 6) Approximate Weight: 12.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. 7 Version 1.
PAGE 8
SFH 4775S Recommended Solder Pad 6) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4775S Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures
PAGE 10
SFH 4775S Tape and Reel 7) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A 180 mm W Nmin 8 + 0.3 / - 0.1 10 Version 1.0 | 2018-11-06 W1 60 W2 max 8.4 + 2 14.
PAGE 11
SFH 4775S Barcode-Product-Label (BPL) Dry Packing Process and Materials 6) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e.
PAGE 12
SFH 4775S Transportation Packing and Materials 6) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 200 ± 5 mm 195 ± 5 mm 12 Version 1.
PAGE 13
SFH 4775S Notes Depending on the mode of operation, these devices emit highly concentrated visible and non visible light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances.
PAGE 14
SFH 4775S Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4775S Glossary 1) Total radiant flux: Measured with integrating sphere. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.