Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 860nm 70mA 1.6V SMD

SFH 4651

Version 1.6 | 2018-11-14

Produktdatenblatt | Version 1.1

www.osram-os.com

Applications

SFH 4651

MIDLED

Narrow beam LED in MIDLED package (850 nm)

— Electronic Equipment

— Gesture Recognition

— Industrial Automation (Machine Controls, Light

Barriers, Vision Controls)

Features:

— Package: clear silicone

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— High Power Infrared LED (40 mW)

— Short switching times

— Narrow half angle (± 10°)

— Taping as Toplooker

— Also available as Sidelooker (SFH4656)

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 70 mA; t

= 20 ms I

= 70 mA; t

= 20 ms

SFH 4651-Z 25 ... 200 mW/sr 60 mW/sr Q65110A8396

SFH 4651-UV 40 ... 125 mW/sr 60 mW/sr Q65111A4394

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4651 SFH 4651 MIDLED ® Narrow beam LED in MIDLED package (850 nm) Applications ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) ——Electronic Equipment ——Gesture Recognition Features: ——Package: clear silicone ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc.
PAGE 2
SFH 4651 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 70 mA Surge current tp ≤ 20 µs; D = 0 IFSM max. 0.7 A Reverse voltage 2) VR max. 12 V Power consumption Ptot max. 140 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4651 Characteristics IF = 70 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 10 ° Dimensions of active chip area LxW typ. 0.2 x 0.2 mm x mm Rise time (10% / 90%) IF = 70 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 70 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.
PAGE 4
SFH 4651 Brightness Groups TA = 25 °C Group Radiant intensity IF = 70 mA; tp = 20 ms min. Ie Radiant intensity IF = 70 mA; tp = 20 ms max. Ie T 25 mW/sr 50 mW/sr U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr 100 mW/sr 200 mW/sr AW Relative Spectral Emission 6), 7) Ie,rel = f (λ); IF = 70 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 λ 4 Version 1.
PAGE 5
SFH 4651 Radiation Characteristics 6), 7) Ie,rel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05593 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0˚ 20˚ 60˚ 80˚ 100˚ 120˚ 6), 7) Ie/Ie(70mA) = f (IF); single pulse; tp = 25 µs OHF03826 100 A OHF04406 101 Ie I e (70 mA) 10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 40˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 2.
PAGE 6
SFH 4651 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 380 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF04057 80 mA IF 70 60 0.7 A 0.6 0.5 50 0.4 40 0.3 30 0.2 20 0 20 40 60 80 100 ˚C 120 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 0.7 A 0.6 0.5 0.4 0.3 0.2 t D = TP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.
PAGE 7
SFH 4651 Dimensional Drawing 8) Approximate Weight: 23.0 mg Pin Description 1 Anode 2 Cathode 7 Version 1.
PAGE 8
SFH 4651 Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4651 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 4651 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A 180 mm W Nmin 8 + 0.3 / - 0.1 10 Version 1.6 | 2018-11-14 W1 60 W2 max 8.4 + 2 14.
PAGE 11
SFH 4651 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e.
PAGE 12
SFH 4651 Transportation Packing and Materials 8) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 200 ± 5 mm 195 ± 5 mm 12 Version 1.
PAGE 13
SFH 4651 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4651 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you.
PAGE 15
SFH 4651 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.