Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 950nm 100mA 1.5V SMD

SFH 4645

Version 1.10 | 2018-10-08

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4645

MIDLED

Narrow beam LED in MIDLED package (940 nm)

Applications

— Flash & Autofocus — Gesture Recognition

Features:

— Package: clear silicone

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— High Power Infrared LED (55 mW)

— Short switching times

— Narrow half angle (± 15°)

— Taping as Sidelooker

— Also available as Toplooker (SFH4640)

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 100 mA; t

= 20 ms I

= 100 mA; t

= 20 ms

SFH 4645-UV 40 ... 125 mW/sr 80 mW/sr Q65110A9606

SFH 4645 40 ... 200 mW/sr 80 mW/sr Q65110A9367

Summary of content (17 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4645 SFH 4645 MIDLED ® Narrow beam LED in MIDLED package (940 nm) Applications ——Flash & Autofocus ——Gesture Recognition Features: ——Package: clear silicone ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc.
PAGE 2
SFH 4645 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 100 mA Surge current tp ≤ 300 µs; D = 0 IFSM max. 1A Reverse voltage 2) VR max. 12 V Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4645 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 15 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.5 V 1.
PAGE 4
SFH 4645 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr 100 mW/sr 200 mW/sr AW Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04134 100 I rel % 80 60 40 20 0 800 850 900 950 nm 1025 λ 4 Version 1.
PAGE 5
SFH 4645 Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF03823 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0˚ 20˚ 60˚ 80˚ 100˚ 120˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF03822 100 A OHF03821 101 Ie I e (100 mA) 10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 40˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 V 2.
PAGE 6
SFH 4645 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 340 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C OHF02533 110 mA IF 1.2 A 1.0 I F 90 80 0.8 70 60 0.6 50 40 0.4 30 20 OHF02532 t tP D = TP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.2 10 0 0 20 40 80 ˚C 100 60 TA 6 Version 1.
PAGE 7
SFH 4645 Dimensional Drawing 8) Approximate Weight: 23.0 mg Pin 1 2 7 Version 1.
PAGE 8
SFH 4645 Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4645 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 4645 Taping 8) Tape and Reel 9) W1 D0 A N E F W P2 13.0 ±0.25 P0 Label P1 Direction of unreeling W2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 10 Version 1.
PAGE 11
SFH 4645 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 1600 330 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 7000 Barcode-Product-Label (BPL) 11 Version 1.
PAGE 12
SFH 4645 Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e nk, bla cod ve If y bar dit mi hu e ed ag el H) (R . % /60 ˚C . RH rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 13
SFH 4645 Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 352 ± 5 mm 352 ± 5 mm 33 ± 5 mm 13 Version 1.
PAGE 14
SFH 4645 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 15
SFH 4645 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 16
SFH 4645 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.