Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 850nm 100mA 1.7V 2016

SFH 4558

Version 1.3 | 2018-04-16

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4558

Radial SMR

Infrared Emitter (850nm) in SMR® Package

Applications

— Electronic Equipment

— Highbay Industrial

— Industrial Automation (Machine controls, Light

barriers, Vision controls)

— Safety systems and CCTV

— Smoke Detectors

— White Goods

Features:

— Package: black epoxy

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Wavelength 850nm

— SMR

(Surface Mount Radial) package

— Same package as photodiode SFH 2505 FA

— Device with straight leads

— UL version available (ordering code & test conditions on request)

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 100 mA; t

= 20 ms I

= 100 mA; t

= 20 ms

SFH 4558 160 ... 800 mW/sr 350 mW/sr Q65111A5984

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4558 SFH 4558 Radial SMR Infrared Emitter (850nm) in SMR® Package Applications ——Electronic Equipment ——Safety systems and CCTV ——Highbay Industrial ——Smoke Detectors ——Industrial Automation (Machine controls, Light barriers, Vision controls) ——White Goods Features: ——Package: black epoxy ——ESD: 2 kV acc.
PAGE 2
SFH 4558 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 200 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 200 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4558 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 10 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.
PAGE 4
SFH 4558 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie BW 160 mW/sr 320 mW/sr CW 250 mW/sr 500 mW/sr DW 400 mW/sr 800 mW/sr Only one group in one packing unit (variation lower 2:1) Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 λ 4 Version 1.
PAGE 5
SFH 4558 Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05688 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0.4 0˚ 20˚ 40˚ 60˚ Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs 100˚ 120˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 100 µs OHF05645 103 mA 80˚ OHF05641 101 Ιe IF Ι e (100 mA) 102 100 5 10-1 101 10-2 5 100 0 1 2 3 V VF 5 Version 1.
PAGE 6
SFH 4558 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 430 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF05687 120 mA IF 100 1.1 A 0.9 0.8 80 0.7 0.6 60 0.5 0.4 40 0.3 OHF05646 t D = TP tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.2 20 0.1 0 0 20 40 60 80 ˚C 100 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 1.1 A OHF05647 t D = TP 0.9 0.8 0.7 0.6 0.5 0.
PAGE 7
SFH 4558 Dimensional Drawing 8.0 (0.315) 7.4 (0.291) 2.54 (0.100) spacing 4.8 (0.189) 4.4 (0.173) 15.5 (0.610) 14.7 (0.579) Cathode 4.5 (0.177) 3.9 (0.154) Approximate Weight: 240.0 mg Package marking: Cathode 7 Version 1.3 | 2018-04-16 7.7 (0.303) 7.1 (0.280) -0.15...0.15 (-0.006...0.006) Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 2.7 (0.106) 2.4 (0.094) 8) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.
PAGE 8
SFH 4558 8) 5.9 (0.232) 2.54 (0.100) 1.3 (0.051) Recommended Solder Pad Bauteil positioniert Component Location on Pad Padgeometrie für verbesserte Wärmeableitung Lötpad (1 (0.039)) 1.5 (0.059) Paddesign for improved heat dissipation 5.2 (0.205) 3 (0.118) Lötstopplack Solder resist Aussparung 4.85 (0.191) ±0.05 (0.002) 7 (0.276) Cu-Fläche > 20 mm 2 Cu-area > 20 mm 2 OHF02450 Reflow Soldering Profile Product complies to MSL Level 3 acc.
PAGE 9
SFH 4558 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 4558 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 330 mm 24 + 0.3 / - 0.1 60/100 24.4 + 2 30.4 1000 10 Version 1.
PAGE 11
SFH 4558 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 4558 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 4558 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4558 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4558 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.001 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 20 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.