Datasheet

SFH 4551
8
Version 1.5 | 2018-04-16
Recommended Solder Pad
7)
OHF02449
5.3 (0.209)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Lötpad
Cu-Fläche > 20 mm
Cu-area > 20 mm
2
2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Bauteil positioniert
Component Location on Pad
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020E
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L