Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 950nm 100mA 1.5V 2016

SFH 4543

Version 1.3 | 2018-04-16

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4543

Radial SMR

High Power Infrared Emitter (940nm) in SMR® Pack-

age

Applications

— Electronic Equipment

— Highbay Industrial

— Industrial Automation (Machine controls, Light

barriers, Vision controls)

— Safety systems and CCTV

— Smoke Detectors

— White Goods

Features:

— Package: black epoxy

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— High Power Infrared LED

— SMR

(Surface Mount Radial) package

— Same package as photodiode SFH 2500

— Short switching times

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 100 mA; t

= 20 ms I

= 100 mA; t

= 20 ms

SFH 4543-Z 100 ... 500 mW/sr 230 mW/sr Q65110A8094

SFH 4543-BWCW 160 ... 500 mW/sr 230 mW/sr Q65111A9678

Summary of content (13 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4543 SFH 4543 Radial SMR High Power Infrared Emitter (940nm) in SMR® Package Applications ——Electronic Equipment ——Safety systems and CCTV ——Highbay Industrial ——Smoke Detectors ——Industrial Automation (Machine controls, Light barriers, Vision controls) ——White Goods Features: ——Package: black epoxy ——ESD: 2 kV acc.
PAGE 2
SFH 4543 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 100 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4543 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 10 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.5 V 1.
PAGE 4
SFH 4543 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie AW 100 mW/sr 200 mW/sr BW 160 mW/sr 320 mW/sr CW 250 mW/sr 500 mW/sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 5), 6) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04134 100 I rel % 80 60 40 20 0 800 850 900 950 nm 1025 λ 4 Version 1.
PAGE 5
SFH 4543 Radiation Characteristics Irel = f (φ) 40˚ 5), 6) 30˚ 20˚ 10˚ ϕ 0˚ OHL03768 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0˚ 20˚ 60˚ 80˚ 100˚ 120˚ 5), 6) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF03822 100 A OHF03821 101 Ie I e (100 mA) 10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 40˚ Radiant Intensity 5), 6) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 V 2.5 VF 5 Version 1.
PAGE 6
SFH 4543 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 300 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF03814 0.11 A IF 1.2 A 1.0 OHF05439 t D = TP tP IF T D= 0.08 0.8 0.07 0.06 0.6 0.05 0.04 0.4 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.03 0.02 0.2 0.01 0 0 10 20 30 40 50 60 70 80 ˚C 100 T Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 1.6 A 1.4 1.2 1.0 0.8 0.6 0.4 0.
PAGE 7
SFH 4543 Dimensional Drawing 8.0 (0.315) 7.4 (0.291) 2.54 (0.100) spacing 4.8 (0.189) 4.4 (0.173) 15.5 (0.610) 14.7 (0.579) Cathode 4.5 (0.177) 3.9 (0.154) Approximate Weight: 237.0 mg Package marking: Cathode 7 Version 1.3 | 2018-04-16 7.7 (0.303) 7.1 (0.280) -0.15...0.15 (-0.006...0.006) Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 2.7 (0.106) 2.4 (0.094) 7) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.
PAGE 8
SFH 4543 7) 5.9 (0.232) 2.54 (0.100) 1.3 (0.051) Recommended Solder Pad Bauteil positioniert Component Location on Pad Padgeometrie für verbesserte Wärmeableitung Lötpad (1 (0.039)) 1.5 (0.059) Paddesign for improved heat dissipation 5.2 (0.205) 3 (0.118) Lötstopplack Solder resist Aussparung 4.85 (0.191) ±0.05 (0.002) 7 (0.276) Cu-Fläche > 20 mm 2 Cu-area > 20 mm 2 OHF02450 Reflow Soldering Profile Product complies to MSL Level 3 acc.
PAGE 9
SFH 4543 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 °C 480 Time 25 °C to TP All temperatur
PAGE 10
SFH 4543 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 11
SFH 4543 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 12
SFH 4543 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere.