Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 950nm 100mA 1.5V SMD

SFH 4441

Version 1.3 | 2018-04-16

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4441

MIDLED

Mini

Narrow beam LED in Mini MIDLED package (940

nm)

Applications

— Remote Control, Proximity, Ambient Light Sens-

ing

Features:

— Package: clear silicone

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Highly E󰘲cient Infrared LED

— Short switching times

— Narrow halfangle (± 17°)

— Low pro󰘰le component

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 100 mA; t

= 20 ms I

= 100 mA; t

= 20 ms

SFH 4441 25 ... 200 mW/sr 65 mW/sr Q65111A4266

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4441 SFH 4441 MIDLED ® Mini Narrow beam LED in Mini MIDLED package (940 nm) Applications ——Remote Control, Proximity, Ambient Light Sensing Features: ——Package: clear silicone ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——Highly Efficient Infrared LED ——Short switching times ——Narrow halfangle (± 17°) ——Low profile component Ordering Information Type Radiant intensity 1) IF = 100 mA; tp = 20 ms Ie 25 ...
PAGE 2
SFH 4441 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 300 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4441 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 17 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.5 V 1.
PAGE 4
SFH 4441 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie T 25 mW/sr 50 mW/sr U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr 100 mW/sr 200 mW/sr AW Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04134 100 I rel % 80 60 40 20 0 800 850 900 950 nm 1025 λ 4 Version 1.
PAGE 5
SFH 4441 Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05558 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0˚ 20˚ 60˚ 80˚ 100˚ 120˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF03822 100 A OHF03821 101 Ie I e (100 mA) 10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 40˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 V 2.
PAGE 6
SFH 4441 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 400 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C OHF05494 110 I F mA IF 90 0.9 80 0.8 70 0.7 60 0.6 50 0.5 40 0.4 30 0.3 20 0.2 10 0.1 0 0 20 40 60 80 ˚C 100 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 1.1 A 1.1 A 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 OHF05493 t D = TP tP IF T D= 0.005 0.01 0.02 0.
PAGE 7
SFH 4441 Dimensional Drawing 8) Approximate Weight: 10.0 mg 7 Version 1.
PAGE 8
SFH 4441 Recommended Solder Pad 8) The package is casted with silicone. Mechanical stress at the surface of the unit should be avoided. Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4441 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 4441 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000 10 Version 1.
PAGE 11
SFH 4441 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 4441 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 4441 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4441 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4441 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.