www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4356 SFH 4356 Radial T1 Infrared Emitter (850 nm) Applications ——Electronic Equipment ——Safety systems and CCTV ——Industrial Automation (Machine controls, Light barriers, Vision controls) ——Smoke Detectors Features: ——Package: black epoxy ——ESD: 2 kV acc.
SFH 4356 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 200 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 200 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
SFH 4356 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 20 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.
SFH 4356 Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr AW 100 mW/sr 200 mW/sr BW 160 mW/sr 320 mW/sr Only one group in one packing unit (variation lower 2:1) Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 λ 4 Version 1.
SFH 4356 Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05658 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0.4 0˚ 20˚ 40˚ 60˚ Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs 100˚ 120˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 100 µs OHF05645 103 mA 80˚ OHF05641 101 Ιe IF Ι e (100 mA) 102 100 5 10-1 101 10-2 5 100 0 1 2 3 V VF 5 Version 1.
SFH 4356 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 350 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF05655 120 mA IF 100 1.1 A 0.9 0.8 80 0.7 0.6 60 0.5 0.4 40 OHF05656 t D = TP tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.3 0.2 20 0.1 0 0 20 40 60 80 ˚C 100 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 1.1 A 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.
SFH 4356 Dimensional Drawing 8) Approximate Weight: 162.0 mg Package marking: Anode 7 Version 1.
SFH 4356 Recommended Solder Pad Pad 1: cathode 8 Version 1.
SFH 4356 TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C First wave Second wave Continuous line: typical process Dotted line: process limits ∆T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C 120 ˚C 100 ˚C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t 9 Version 1.
SFH 4356 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
SFH 4356 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
SFH 4356 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
SFH 4356 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 13 Version 1.