Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 860nm 100mA 3.1V PLCC4

SFH 4259S

Version 1.4 | 2018-04-16

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4259S

Power TOPLED

Lens

High Power Infrared Emitter (850 nm)

Applications

— 3D Capturing

— Access Control / Biometrics (IRIS, Scan, Vein

scan)

— CCTV Surveillance

— Gaming, Amusement, Gambling

— Gesture Recognition

— Industrial Automation (Machine controls, Light

barriers, Vision controls)

— Safety systems and CCTV

— VMS

— White Goods

Features:

— Package: Epoxy, di󰘯use

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— High Power Infrared LED

— Double stack emitter

— Half angle: ± 25°

— High forward current allowed at high temperature

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 100 mA; t

= 20 ms I

= 100 mA; t

= 20 ms

SFH 4259S 40 ... 200 mW/sr 85 mW/sr Q65111A1159

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.
PAGE 2
SFH 4259S Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 100 mA Surge current tp ≤ 300 µs; D = 0 IFSM max. 0.7 A Power consumption Ptot max. 245 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4259S Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 25 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 15 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 15 ns Forward voltage VF typ. max. 3.1 V 3.
PAGE 4
SFH 4259S Brightness Groups TA = 25 °C Group Radiant intensity IF = 100 mA; tp = 20 ms min. Ie Radiant intensity IF = 100 mA; tp = 20 ms max. Ie U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr 100 mW/sr 200 mW/sr AW Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 λ 4 Version 1.
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SFH 4259S Radiation Characteristics 6), 7) Irel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHL00999 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 0.4 20˚ 40˚ 60˚ 80˚ 100˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0˚ 6), 7) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF05562 103 mA 120˚ OHF05698 101 Ιe Ι e (100 mA) 102 100 10-1 101 10-2 100 2 3 4 V VF 5 Version 1.
PAGE 6
SFH 4259S Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f(TA), RTHJA = 300 K/W, RTHJS = 140 K/W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF05696 120 mA IF 100 0.8 A 0.7 OHF05697 t D = TP tP IF T 0.6 80 R thJA 0.5 R thJS 60 0.4 0.3 40 0.2 20 0 0.1 0 20 40 60 80 ˚C 100 TA , TS Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C 0.75 IF A D= 0.005 0.01 0.02 0.05 0.1 0.2 0.
PAGE 7
SFH 4259S Dimensional Drawing 8) 3.5 (0.138) max. 2.1 (0.083) 1.7 (0.067) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.9 (0.035) 0.7 (0.028) 2.1 (0.083) 0.5 (0.020) Package marking 0.18 (0.007) ø2.55 (0.100) ø2.60 (0.102) 0.1 (0.004) typ 1.1 (0.043) 1 3.7 (0.146) 3.3 (0.130) 3.4 (0.134) 3.0 (0.118) 2 4˚±1 4 (2.4) (0.095) 3 0.6 (0.024) 0.4 (0.016) 0.13 (0.005) GPLY6128 Approximate Weight: 37.
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SFH 4259S Recommended Solder Pad 8) Padgeometrie für verbesserte Wärmeableitung 3.3 (0.130) Paddesign for improved heat dissipation 3.3 (0.130) 2.3 (0.091) 11.1 (0.437) 1.5 (0.059) 1.1 (0.043) 3.7 (0.146) 0.8 (0.031) 0.7 (0.028) Cu Fläche / <_ 16 mm 2 per pad Cu-area Lötstoplack Solder resist OHFP3021 Reflow Soldering Profile Product complies to MSL Level 2 acc.
PAGE 9
SFH 4259S Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP Maximum 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 250 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 4 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures
PAGE 10
SFH 4259S Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000 10 Version 1.
PAGE 11
SFH 4259S Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 4259S Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 4259S Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4259S Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4259S Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.