Datasheet

ManualsBrandsOsram Opto Semiconductors ManualsIR EmittersIR Emitter 860nm 70mA 1.45V 1204

SFH 4254

Version 1.2 | 2018-05-30

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4254

Micro SIDELED

High Power Infrared Emitter (850 nm)

Applications

— Electronic Equipment — Gesture Recognition

Features:

— Package: clear epoxy

— Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Homogenous Radiation Pattern

— Peak wavelength typ. 860 nm

— Short switching times

Ordering Information

Type Radiant intensity

Radiant intensity

Ordering Code

typ.

= 70 mA; t

= 20 ms I

= 70 mA; t

= 20 ms

SFH 4254 6.3 ... 20.0 mW/sr 12 mW/sr Q65110A6462

Summary of content (16 pages)

PAGE 1
www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4254 SFH 4254 Micro SIDELED ® High Power Infrared Emitter (850 nm) Applications ——Electronic Equipment ——Gesture Recognition Features: ——Package: clear epoxy ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——Homogenous Radiation Pattern ——Peak wavelength typ.
PAGE 2
SFH 4254 Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage 2) VR max. 12 V Forward current IF max. 70 mA Surge current tp ≤ 10 µs; D = 0 IFSM max. 1A Power consumption Ptot max. 125 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.
PAGE 3
SFH 4254 Characteristics IF = 70 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm Half angle φ typ. 60 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 70 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 70 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.45 V 1.
PAGE 4
SFH 4254 Brightness Groups TA = 25 °C Group Radiant intensity IF = 70 mA; tp = 20 ms min. Ie Radiant intensity IF = 70 mA; tp = 20 ms max. Ie Q 6.3 mW/sr 12.5 mW/sr R 10.0 mW/sr 20.0 mW/sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Irel = f (λ); IF = 70 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 λ 4 Version 1.
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SFH 4254 Radiation Characteristics 6), 7) Irel = f (ϕ); TA = 25 °C 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 Ie/Ie(70mA) = f (IF); single pulse; tp = 25 µs OHL01713 100 A 6), 7) OHF05608 101 Ιe Ι e (70 mA) 10-1 5 100 10-1 10-2 5 10-2 10-3 5 10-4 0 0.5 1 1.5 2 2.
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SFH 4254 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 530 K / W IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF03537 80 mA OHF03536 1.0 IF A tP tP D= T 0.8 60 0.7 50 0.6 40 0.5 30 0.4 0.3 20 IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 0.2 10 0 0.1 0 10 20 30 40 50 60 70 80 ˚C 100 TA 6 Version 1.
PAGE 7
SFH 4254 Dimensional Drawing 8) 0.3 (0.012) 0.20 (0.008) 1.0 (0.039) (15˚) 2.1 (0.083) 0.5 (0.020) 1.2 (0.047) C 2.3 (0.091) 0.7 (0.028) Anode (0.6 (0.024)) (0.4 (0.016)) typ. 0.3 (0.012) Chipcenter 2.9 (0.114) 3.1 (0.122) 0 ... 0.1 (0 ... 0.004) 0.5 (0.020) 0.25 (0.010) 1.3 (0.051) A 1.1 (0.043) GPLY7025 Approximate Weight: 6.0 mg 7 Version 1.
PAGE 8
SFH 4254 Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 8 Version 1.
PAGE 9
SFH 4254 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures r
PAGE 10
SFH 4254 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000 10 Version 1.
PAGE 11
SFH 4254 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ).
PAGE 12
SFH 4254 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster
PAGE 13
SFH 4254 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
PAGE 14
SFH 4254 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
PAGE 15
SFH 4254 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 5 mm² each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.