Datasheet

SFH 3600
8
Version 1.5 | 2018-08-08
Pad 1: collector The package is casted with silicone. Mechanical stress at the surface of the unit should be avoided.
Recommended Solder Pad
5)
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L