Datasheet

GH CSSRM3.24
13
Version 1.4 | 2019-09-11
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat
*)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
60 100 120 s
Ramp-up rate to peak
*)
T
Smax
to T
P
2 3 K/s
Liquidus temperature T
L
217 °C
Time above liquidus temperature t
L
80 100 s
Peak temperature T
P
245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature T
P
- 5 K
t
P
10 20 30 s
Ramp-down rate*
T
P
to 100 °C
3 6 K/s
Time
25 °C to T
P
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range