www.osram-os.com Produktdatenblatt | Version 1.1 BP 104 FASR BP 104 FASR DIL SMT Silicon PIN Photodiode with Daylight Blocking Filter Applications ——Rain sensors Features: ——Package: black epoxy ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc.
BP 104 FASR Maximum Ratings TA = 25 °C Parameter Symbol Operating Temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage VR max. 20 V Total power dissipation Ptot max. 150 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 Version 1.
BP 104 FASR Characteristics TA = 25 °C Parameter Symbol Wavelength of max sensitivity λS max typ. 880 nm Spectral range of sensitivity λ10% typ. 730 ... 1100 nm Radiant sensitive area A typ. 4.84 mm² Dimensions of active chip area LxW typ. 2.2 x 2.2 mm x mm Half angle φ typ. 60 ° Dark current VR = 10 V IR typ. max. Spectral sensitivity of the chip λ = 870 nm Sλ typ. 0.63 A / W Quantum yield of the chip λ = 870 nm η typ. 0.
BP 104 FASR Relative Spectral Sensitivity 1), 2) Srel = f (λ) OHF01430 100 Srel % 80 70 60 50 40 30 20 10 0 400 Directional Characteristics 600 800 1000 nm 1200 λ 1), 2) Srel = f (φ) 40 50 30 20 10 60 ϕ 0 1.0 0.8 0.6 70 0.4 80 0.2 0 90 1.0 0.8 100 OHF01402 4 Version 1.3 | 2018-05-30 0.6 0.
BP 104 FASR Photocurrent/Open-Circuit Voltage IP (VR = 5 V) / VO = f (Ee) Dark Current 1), 2) IR = f (VR) ; E = 0 OHF01056 10 3 µA ΙP 1), 2) 10 2 10 4 mV OHF00080 4000 VO ΙR pA 10 3 3000 10 2 2000 10 1 1000 10 0 0 VO 10 1 ΙP 10 0 10 -1 10 0 10 1 10 2 2 µW/cm 10 4 Ee Dark Current 1), 2) IR = f (VR) ; E = 0 OHF02284 10 2 nA ΙR 10 1 10 0 10 -1 0 2 4 6 8 10 12 14 16 V 20 VR 5 Version 1.
BP 104 FASR Capacitance 1), 2) C = f (VR); f = 1 MHz; E = 0; OHF01778 60 pF C 50 40 30 20 10 0 -2 10 10 -1 Dark Current 10 0 10 1 V 10 2 VR 2) IR = f (TA); E = 0; VR = 10 V OHF05717 104 IR nA 103 102 101 100 10-1 0 20 40 60 80 ˚C 100 TA 6 Version 1.
BP 104 FASR Power Consumption Ptot = f (TA); OHF00394 160 mW Ptot 140 120 100 80 60 40 20 0 0 20 40 60 80 ˚C 100 TA 7 Version 1.
BP 104 FASR Chip position 6.2 (0.244) 0.9 (0.035) 0.7 (0.028) 4.5 (0.177) 4.3 (0.169) 0...5 6.7 (0.264) ˚ 0.2 (0.008) 0.1 (0.004) 1.1 (0.043) 0.9 (0.035) 1.6 (0.063) ±0.2 (0.008) 1.7 (0.067) 1.5 (0.059) 4.0 (0.157) 3.7 (0.146) 0.3 (0.012) 3) 1.2 (0.047) 1.1 (0.043) 0...0.1 (0...0.004) Dimensional Drawing Photosensitive area Cathode lead 2.20 (0.087) x 2.20 (0.087) GPLY7049 Approximate Weight: 44.0 mg Package marking: Cathode 8 Version 1.
BP 104 FASR Recommended Solder Pad 3) Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 150 tL tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t 9 Version 1.
BP 104 FASR Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum 2 3 100 120 2 3 Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 10 Ramp-down rate* TP to 100 °C °C 480 Time 25 °C to TP All temperat
BP 104 FASR Tape and Reel 4) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500 11 Version 1.
BP 104 FASR Barcode-Product-Label (BPL) Dry Packing Process and Materials 3) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ).
BP 104 FASR Transportation Packing and Materials 3) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Must
BP 104 FASR Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.
BP 104 FASR Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
BP 104 FASR Glossary 1) Testing temperature: TA = 25°C 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ.
BP 104 FASR Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 17 Version 1.