Integration Manual

GTM353W Integration Manual
Author:
R
. Claessens
Version:
4.0 Draft 2
Creation Date:
September 20, 2006
Page:
8 of 52
Option Confidential:
This document is Option Confidential - it may not be duplicated, neither distributed externally without prior and written permission of
Option NV.
2 GENERAL OVERVIEW DIAGRAM
Figure 3 gives a high level system overview. Option provides the communication and
physical layer. On the physical layer, the bottom interfaces (in dark color) are explicit
notations to show the integrator which physical connection capabilities can be used.
Figure 3: High level system overview
The Communication Layer components are described in chapter 4 and chapter 5. An overview
of the supported AT commands is given in chapter 6
USER APPLICATION
(e-mail, http,...)
TCP
UDP
/ IP
PPP
USER APPLICATION
(SMS, signal strength,...)
AT commands
COM
NDIS
USB
PCIExpress Mini Card
Embedded Stack
Hardware platform
Application
(eg. Hyper-
terminal,
SMS app.,
dashboard)
Communica-
tion Layer
Physical
Layer
(U)SIM
connector
Mini PCIExpress
connector
RF
connector
LED
APPLICATION DEBUG PPP